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Reduction of mounting area by small surface-mount package compatible with high voltage

Comparison of package sizes

In the market for small motors, where conventional through-hole packages are the mainstream, there is a need for small surface-mount device (SMD) packages that realize high-density mounting and ease of mounting. In addition to the HSSOP31 for which effective heat dissipation from packages is realized through the use of exposed pads (E-Pad), we have introduced the new highly efficient SSOP30 lineup using multi-chip modules.  Improved motor system performance is expected.

HSSOP31 and SSOP30, our small-size packages, are about 61% and 47% smaller than the DIP26 conventional through-hole package, respectively.

In both HSSOP31 and SSOP30, the high-voltage terminal and the low-voltage terminal are separated from each other on both sides of the package, and the distance between the high-voltage terminals is greater than 2.4 mm. These packages have a height of 2.2 mm (maximum) and can be built into the control board in the mold motor.

3-Phase Brushless DC Motor Driver ICs

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