Reduction of mounting area by small surface-mount package compatible with high voltage

Comparison of package sizes

In the market for small motors, where conventional through-hole packages are the mainstream, there is a need for small surface-mount device (SMD) packages that realize high-density mounting and ease of mounting. In addition to the HSSOP31 for which effective heat dissipation from packages is realized through the use of exposed pads (E-Pad), we have introduced the new highly efficient SSOP30 lineup using multi-chip modules.  Improved motor system performance is expected.

HSSOP31 and SSOP30, our small-size packages, are about 61% and 47% smaller than the DIP26 conventional through-hole package, respectively.

In both HSSOP31 and SSOP30, the high-voltage terminal and the low-voltage terminal are separated from each other on both sides of the package, and the distance between the high-voltage terminals is greater than 2.4 mm. These packages have a height of 2.2 mm (maximum) and can be built into the control board in the mold motor.

3-Phase Brushless DC Motor Driver ICs

Related information


Technical inquiry

Contact us

Contact us

Frequently Asked Questions


Queries about purchasing, sampling and IC reliability

Stock Check & Purchase


Click this link to check inventory of TOSHIBA parts available at those distributors of Toshiba Electronics Europe GmbH ("TEE") who participate in netCOMPONENTS electronic components sourcing database. By clicking “click here to purchase” above, you will be opening a new browser window and leave our website to the each distributor's page. Please note that TEE provides this link solely as a convenience and for informational purposes only. By providing the link TEE does not guarantee availability of TOSHIBA part(s) as presented on the each distributor's page. TEE bears no responsibility for the accuracy or content of this external site. All information on this StockCheck page about TOSHIBA parts and their availability are provided by the netCOMPONENTS electronic components sourcing database.
A new window will open