- General Top View
-
SEMICONDUCTOR View
-
ApplicationsAutomotive
Body Electronics
xEV
In-Vehicle Infortainment
Advanced Driver-Assistance Systems (ADAS)
Chassis
IndustrialInfrastructure
BEMS/HEMS
Factory Automation
Consumer/PersonalIoT Equipment
Healthcare
Wearable Device
Mobile
Computer Peripherals
-
Products
Products
-
Design & Development
-
Knowledge
Knowledge
- Where To Buy View
-
- STORAGE View
- COMPANY View
- Part Number Search
- Cross Reference Search
- Keyword Search
- Parametric Search
- Stock Check & Purchase
This webpage doesn't work with Internet Explorer. Please use the latest version of Google Chrome, Microsoft Edge, Mozilla Firefox or Safari.
require 3 characters or more.
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
require 3 characters or more.
Reduction of mounting area by small surface-mount package compatible with high voltage
In the market for small motors, where conventional through-hole packages are the mainstream, there is a need for small surface-mount device (SMD) packages that realize high-density mounting and ease of mounting. In addition to the HSSOP31 for which effective heat dissipation from packages is realized through the use of exposed pads (E-Pad), we have introduced the new highly efficient SSOP30 lineup using multi-chip modules. Improved motor system performance is expected.
HSSOP31 and SSOP30, our small-size packages, are about 61% and 47% smaller than the DIP26 conventional through-hole package, respectively.
In both HSSOP31 and SSOP30, the high-voltage terminal and the low-voltage terminal are separated from each other on both sides of the package, and the distance between the high-voltage terminals is greater than 2.4 mm. These packages have a height of 2.2 mm (maximum) and can be built into the control board in the mold motor.
3-Phase Brushless DC Motor Driver ICs
Related information
Queries about purchasing, sampling and IC reliability
Stock Check & Purchase
require 3 characters or more.
| Part Number | Authorized Distributor | Stock Quantity | Date | Shopping Cart |
|---|
Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.