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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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Reduction of mounting area by small surface-mount package compatible with high voltage

Comparison of package sizes

In the market for small motors, where conventional through-hole packages are the mainstream, there is a need for small surface-mount device (SMD) packages that realize high-density mounting and ease of mounting. In addition to the HSSOP31 for which effective heat dissipation from packages is realized through the use of exposed pads (E-Pad), we have introduced the new highly efficient SSOP30 lineup using multi-chip modules.  Improved motor system performance is expected.

HSSOP31 and SSOP30, our small-size packages, are about 61% and 47% smaller than the DIP26 conventional through-hole package, respectively.

In both HSSOP31 and SSOP30, the high-voltage terminal and the low-voltage terminal are separated from each other on both sides of the package, and the distance between the high-voltage terminals is greater than 2.4 mm. These packages have a height of 2.2 mm (maximum) and can be built into the control board in the mold motor.

3-Phase Brushless DC Motor Driver ICs

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