In developing your designs, please ensure the datasheet.

Toshiba Package Code SSOP30
Mounting Surface Mount
Pins 30
Package Dimensions (mm)
Land pattern dimensions for
reference only (mm)

Package SSOP30-P-300-0.65
Land pattern SSOP30-P-300-0.65_LP
Thermal resistance (℃/W) 66.9
Packing Method Tray Packaging
Minimum Quantity 168 pcs/Tray
Tray Dimensions (mm)
Semiconductor Package
Mount Manual

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