SiC MOSFETs

Wide band gap power semiconductors leverage the benefits of Toshiba’s second-generation SiC (silicon carbide) device structure to achieve attractive benefits for high voltage products. Toshiba’s SiC MOSFETs offer improved reliability, superior operation in high-temperature environments, high-speed switching and low on-resistance characteristics compared to conventional Si (silicon) power semiconductors. SiC MOSFETs are suitable for a variety of high-power, high-efficiency applications including industrial power supplies, solar inverters, and UPS.

Lineup

 (@Ta=25°C unless otherwise specified)

Generation  Part  Number Package Absolute Maximum Ratings Electrical Characteristics SampleCheck&Availability
VDSS
(V)
VGSS
(V)
ID
(A)
RDS(ON)
(mΩ)
Vth
(V)
Qg
(nC)
Ciss
(pF)
Tc=25°C VGS=18V VDS=10V
typ. typ. typ.
3rd TW015N120C TO-247 1200 -10 to 25 100 15 3.0 to 5.0 158 6000 Stock Checking
TW030N120C 60 30 82 2925 Stock Checking
TW045N120C 40 45 57 1969 Stock Checking
TW060N120C 36 60 46 1530 Stock Checking
TW140N120C 20 140 24 691 Stock Checking
TW015N65C 650 100 15 128 4850 Stock Checking
TW027N65C 58 27 65 2288 Stock Checking
TW048N65C 40 48 41 1362 Stock Checking
TW083N65C 30 83 28 873 Stock Checking
TW107N65C 20 107 21 600 Stock Checking
TW015Z120C TO-247-4L(X) 1200 100 15 158 6000 Stock Checking
TW030Z120C 60 30 82 2925 Stock Checking
TW045Z120C 40 45 57 1969 Stock Checking
TW060Z120C 36 60 46 1530 Stock Checking
TW140Z120C 20 140 24 691 Stock Checking
TW015Z65C 650 100 15 128 4850 Stock Checking
TW027Z65C 58 27 65 2288 Stock Checking
TW048Z65C 40 48 41 1362 Stock Checking
TW083Z65C 30 83 28 873 Stock Checking
TW107Z65C 20 107 21 600 Stock Checking
3rd generation Silicon Carbide(SiC) MOSFETs
Toshiba's 3rd generation Silicon Carbide (SiC) MOSFETs introduces a selection of both 650V and 1200V voltage products. In common with 2nd generations, Toshiba's newest generation of MOSFETs include a built-in SiC Schottky Barrier Diode (SBD) with a low forward voltage (VF) of -1.35V (typ.), placed in parallel with the PN diode in the SiC MOSFETs, to suppress fluctuation in RDS(on) thereby enhancing reliability. Furthermore, Toshiba’s advanced SiC process[1] has greatly improved our on-resistance per unit area RonA, and the performance index Ron*Qgd, which indicates switching characteristics, compared to 2nd generation products. Also, it has easy to design gate drive circuit, and you can prevent malfunctions due to switching noise.
Toshiba's 3rd generation SiC MOSFETs provides lower power consumption and supports higher power density for applications such as switching power supplies (servers for data centers, communication equipment, etc.), uninterruptible power supplies (UPS), PV inverters, EV charging stations, etc.
3rd generation Silicon Carbide(SiC) MOSFETs
3rd generation SiC MOSFETs TO-247-4L
Compared to Si (silicon) IGBTs and MOSFETs, which are currently mainstream, power MOSFETs using SiC (silicon carbide) not only excel in low conduction loss and operation in high-temperature environments, but also contribute to low-loss application through high-speed switching. TO-247-4L(X), a new package for our 3rd generation SiC MOSFETs, is a 4-terminal type, and by reducing the influence of the inductance of the source wire inside the package, it is possible to draw out high-speed switching performance. This contributes to lower loss in applications such as servers, uninterruptible power supplies (UPS), and Photovoltaics Inverter.
3rd generation SiC MOSFETs TO-247-4L
2nd Generation SiC MOSFETs/IGBT Switching Loss Comparison
Toshiba’s TW070J120B 1200V SiC MOSFETs features low ON-resistance, low input capacitance and low total gate charge enabling it to achieve high switching speeds and reduced power consumption.
2nd Generation Features of SiC MOSFETs
Since the dielectric breakdown strength of SiC (silicon carbide) is about 10 times as high as that of Si (silicon), SiC power devices can offer a high withstand voltages and low on-resistance.
What are the merits of using SiC MOSFETs?
Toshiba SiCMOS achieves low on-resistance and high-speed switching compared with Si IGBT.
Open a new door for power supply with Toshiba’s SiC MOSFETs
SiC MOSFETs support downsizing and low-loss power supplies
Product
3-Phase AC 400 V Input PFC Converter Reference Design
Using 2nd Generation SiC MOSFETs to improve the efficiency of power supply systems
5 kW Isolated Bidirectional DC-DC Converter Reference Design
Using 2nd Generation SiC MOSFETs to improve the efficiency of power supply systems

Documents

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Technical topics

Reference Design

PCB Photo (example)
1.6 kW Server Power Supply (Upgraded)
Thanks to Toshiba’s latest power devices and digital isolator, this 1U size and 12 V output 1.6 kW server power supply achieves higher efficiency at whole load than the existing reference design which uses the same circuit topology. Design files and guides for circuit design and operation are available as reference design.
3-Phase Inverter Using SiC MOSFET
This reference design provides design guide, data and other contents of the 3-phase inverter using 1200 V SiC MOSFET. It drives AC 440V motors.
Image of 5 kW Isolated Bidirectional DC-DC Converter.
5 kW Isolated Bidirectional DC-DC Converter
This reference design provides design guide, data and other contents of 5kW Isolated Bidirectional DC-DC Converter using dual active bridge (DAB) conversion method with 1200V SiC MOSFETs.
DC-DC Converter
images of 3-phase AC 400V Input PFC converter.
3-Phase AC 400V Input PFC Converter
This reference design provides design guide, data and other contents of 4 kW 3-phase AC 400 V input PFC converter using 3-phase totem-pole topology with 1200 V SiC MOSFET.

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Uninterruptible Power Supply

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