Photorelays (MOSFET Output)

Photorelays are a type of photocouplers consisting of an LED optically coupled with a MOSFET. Photorelays offer many advantages over mechanical relays such as long service life, low-current drive and fast response. Photorelays are widely used for contact switching in semiconductor test systems, security systems, etc. Toshiba offers low RON, low COFF photorelays in ultra-small VSON/S-VSON packages for semiconductor test system applications, and general-purpose photorelays in various packages featuring high current and high off-state voltage.

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ION (Max) (A)
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RON (Max) (Ω)
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You can narrow down your search for applicable products by package type or number of pins.

unit:
S-VSON4

Package Size

W : 1.45 mm 0.057 inch
L : 2.0 mm 0.079 inch
H : 1.65 mm 0.065 inch
S-VSON4T

Package Size

W : 1.45 mm 0.057 inch
L : 2.0 mm 0.079 inch
H : 1.3 mm 0.051 inch
WSON4

Package Size

W : 1.45 mm 0.057 inch
L : 2.0 mm 0.079 inch
H : 0.8 mm 0.031 inch
VSON4

Package Size

W : 1.45 mm 0.057 inch
L : 2.45 mm 0.096 inch
H : 1.3 mm 0.051 inch
VSONR4

Package Size

W : 1.45 mm 0.057 inch
L : 2.75 mm 0.11 inch
H : 1.3 mm 0.051 inch
P-SON4

Package Size

W : 3.4 mm 0.13 inch
L : 2.1 mm 0.083 inch
H : 1.3 mm 0.051 inch
USOP4

Package Size

W : 2.2 mm 0.087 inch
L : 3.25 mm 0.13 inch
H : 1.65 mm 0.065 inch
4pin SO6

Package Size

W : 3.7 mm 0.15 inch
L : 7.0 mm 0.28 inch
H : 2.1 mm 0.083 inch
2.54SOP4

Package Size

W : 3.9 mm 0.15 inch
L : 7.0 mm 0.28 inch
H : 2.1 mm 0.083 inch
2.54SOP6

Package Size

W : 6.3 mm 0.25 inch
L : 7.0 mm 0.28 inch
H : 2.1 mm 0.083 inch
SO16L-T

Package Size

W : 10.3 mm 0.41 inch
L : 10.0 mm 0.39 inch
H : 2.45 mm 0.096 inch
S-VSON16T

Package Size

W : 6.25 mm 0.25 inch
L : 2.0 mm 0.079 inch
H : 1.3 mm 0.051 inch
DIP4

Package Size

W : 4.58 mm 0.18 inch
L : 7.62 mm 0.30 inch
H : 3.65 mm 0.14 inch
DIP4(F type)

Package Size

W : 4.58 mm 0.18 inch
L : 10.16 mm 0.40 inch
H : 3.65 mm 0.14 inch
DIP6

Package Size

W : 7.12 mm 0.28 inch
L : 7.62 mm 0.30 inch
H : 3.65 mm 0.14 inch
DIP6(F type)

Package Size

W : 7.12 mm 0.28 inch
L : 10.16 mm 0.40 inch
H : 3.65 mm 0.14 inch
DIP8

Package Size

W : 9.66 mm 0.38 inch
L : 7.62 mm 0.30 inch
H : 3.65 mm 0.14 inch

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

Technical Articles

Contact (Mechanical Relay) and Contactless (Semiconductor Relay)
What is a photorelay?
Relays are electrically operated switches and can be broadly classified into contact (mechanical) and contactless (semiconductor) types. Photorelays are semiconductor relays consisting of an LED optically coupled to a MOSFET and are used mainly as signal relay replacements. Having no movable contacts, photorelays are known to have better long-term reliability than mechanical relays.
세부 사항

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Small photorelay with high-speed switching
Low-voltage and high-speed switching photorelay, TLP3450S contributes to faster product test times for semiconductor testers.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Photocouplers for high-speed communications
Mass production of four photocouplers for high-speed communications that can operate normally even when the rise time and fall time are slow.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Compact photorelays with low voltage drive and high temperature operation rating for Semiconductor Tester
Toshiba commercialized TLP3412SRLA with low operating voltage for 1.8 V system FPGA, High operating temperature ratings for securing equipment temperature margins and Small package S-VSON4T for high density mounting

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Contributing to improved reliability of equipment in intense noise environments
Toshiba just released and begun mass production of TLP241BP, the first DIP4 package photorelay[Note 1] with OFF-state output terminal voltage 80 V, over temperature protection and over voltage protection functions.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

110°C Operation Guaranteed, High-capacity Compact Photorelay
Contributes to Downsizing, and Long-life of the Load Control Unit

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Photorelays using the latest-generation U-MOS
Toshiba photorelays can be developed faster by applying the latest-generation MOSFET manufactured in-house.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

Small S-VSON4 packages
S-VSON4 packages have been developed for use in measuring instruments, enabling space-saving packaging.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

High-current (high-capacity) photorelay
Products with a current rating of maximum 5 A and a blocking withstand voltage of maximum 600 V have been prepared and can be used in a wide range of applications.

Isolators/Solid State Relays / Solid State Relays / Photorelays (MOSFET Output)

UL 508 certification
Switching devices including Mechanical relays and Solid State Relays are requested to comply with the UL 508 standard.

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Such as AC isolation, high efficiency and miniaturization are important in designing smart plug. Toshiba provides information on a wide range of semiconductor products suitable for AC switch units, power supply units, wireless and key switch units, etc., along with circuit configuration examples.
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