This webpage doesn't work with Internet Explorer. Please use the latest version of Google Chrome, Microsoft Edge, Mozilla Firefox or Safari.
3글자 이상 입력하세요.
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
3글자 이상 입력하세요.
Since it is common to install heat sinks in self-standing power devices, we are offering Rth(ch-c) and Rth(j-c). (There are exceptions in some products.)
Channel-to-case (or junction-to-case) thermal resistance values should be used for more accurate thermal calculations instead of channel-to-ambient (or junction-to-ambient) thermal resistance values. Be sure to use Rth(ch-c) or Rth(j-c) if it is specified.
Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes (PDF:1,061KB)