QFP Type

Features of QFP(Quad Flat Package)

  • Features: Low profile and cost effective
  • Structure: The die is attached to a die attach paddle with an adhesive and wire-bonded to leadframes in an overmolded package body.
  • Intended Use: Consumer equipment, office equipment, etc.
  • Lead Pitch: 0.4 / 0.5 / 0.65 / 0.8 (mm)
  • Body size: 7 x 7 to 24 x 24(mm)
  • Lead Count: 32 to 176
ASIC31_3

QFP Lineup

Package Type Package Name Pins Body Size
(mm)		 Pin Pitch
(mm)		 Height(Max)
(mm)
LQFP 32 7 x 7 0.8 1.7
44 10 x 10 0.8 1.6
44 10 x 10 0.8 1.7
44 10 x 10 0.8 1.6
48 7 x 7 0.5 1.85
48 7 x 7 0.5 1.6
48 7 x 7 0.5 1.6

52

 10 x 10 0.65 1.6
64 10 x 10 0.5 1.7
64 10 x 10 0.5 1.85
64 10 x 10 0.5 1.85
64 10 x 10 0.5 1.6
64 12 x 12 0.5 1.6
80 12 x 12 0.5 1.85
80 12 x 12 0.5 1.6
80 12 x 12 0.5 1.85
100 14 x 14 0.5 1.85
100 14 x 14 0.5 1.6
100 14 x 14 0.5 1.6
100 14 x 14 0.5 1.7
100 14 x 14 0.5 1.7
144 20 x 20 0.5 1.85
176 20 x 20 0.4 1.7
176 20 x 20 0.4 1.6
176 20 x 20 0.4 1.85
176 24 x 24 0.5 1.7
176 24 x 24 0.5 1.7
HQFP 100 14 x 14 0.5 1.2
144 20 x 20 0.5 1.6
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