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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Features of QFP(Quad Flat Package)

  • Features: Low profile and cost effective
  • Structure: The die is attached to a die attach paddle with an adhesive and wire-bonded to leadframes in an overmolded package body.
  • Intended Use: Consumer equipment, office equipment, etc.
  • Lead Pitch: 0.4 / 0.5 / 0.65 / 0.8 (mm)
  • Body size: 7 x 7 to 24 x 24(mm)
  • Lead Count: 32 to 176
ASIC31_3

QFP Lineup

Package Type Package Name Pins Body Size
(mm)
Pin Pitch
(mm)
Height(Max)
(mm)
LQFP 32 7 x 7 0.8 1.7
44 10 x 10 0.8 1.6
44 10 x 10 0.8 1.7
44 10 x 10 0.8 1.6
48 7 x 7 0.5 1.85
48 7 x 7 0.5 1.6
48 7 x 7 0.5 1.6

52

10 x 10 0.65 1.6
64 10 x 10 0.5 1.7
64 10 x 10 0.5 1.85
64 10 x 10 0.5 1.85
64 10 x 10 0.5 1.6
64 12 x 12 0.5 1.6
80 12 x 12 0.5 1.85
80 12 x 12 0.5 1.6
80 12 x 12 0.5 1.85
100 14 x 14 0.5 1.85
100 14 x 14 0.5 1.6
100 14 x 14 0.5 1.6
100 14 x 14 0.5 1.7
100 14 x 14 0.5 1.7
144 20 x 20 0.5 1.85
176 20 x 20 0.4 1.7
176 20 x 20 0.4 1.6
176 20 x 20 0.4 1.85
176 24 x 24 0.5 1.7
176 24 x 24 0.5 1.7
HQFP 100 14 x 14 0.5 1.2
144 20 x 20 0.5 1.6
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