The RTE900/H1 On-Chip Debug Emulation System consists of Integrated Development Environment, RTE900/H1 On-Chip Debug Emulator and a communication cable. It provides various debug functions by controlling the on-chip debug function of the microcomputer mounted onto the target system.
Host interface | USB2.0 High-speed | |
---|---|---|
Emulation memory | Target memory | |
Event | Number of points | 8 points |
Comparison items | Address, data, status, external input | |
Comparison conditionscondition | Match, unmatch, range | |
Pass count | 1 to 256 times | |
Event trigger actions | Break, trace control, timer control, external trigger output | |
Event combinations | AND, OR, sequential | |
Hardware break | 4 points | |
Software break | 1024 points | |
Trace memory Capacity | 256 frames (Notes-1) | |
Trace memory Modes | Free trace, trigger trace, sampling trace | |
Trace items | PC address, data address, data value, status, external output, external input, event | |
Trace overflow actions | Overwriting, overwriting prohibit, break | |
Timer measurement | Run timer: 1 channel, Lap timer: 1 channel | |
Memory access | Memory display during program execution | 64 bytes |
Memory rewrite during program execution | 1 address(byte/word/Long word either) (Notes-2) | |
Program variables | Display | Binary, octal, decimal or hexadecimal display can be selected for each variable. |
Registration | Variables, arrays, structures and unions can be registered by the elements. | |
Sauce display | - Source - Source + assembler code - Source + assembler code + machine language |
|
External output | 1 line | |
External input | 1 line | |
Performance analysis: Module time measurement | - | |
Performance analysis: Coverage measurement | - | |
Flash programming/security feature | External Flash memory can be programmed during debugging. |
(Notes-1) There are some cases where the trace memory capacity varies by a tracing condition or operating status.
(Notes-2) A break occurs whenever rewritten.
Content of Product
Items to Be Prepared by Customer
About Connection to Target System
Seeing the following pin assignment table, etc., lay out/mount the Communication Connector (FTSH series 20pin connector made by Samtec, Inc.) on to the target system where the On-chip debug emulation system is to be connected.
One Communication Connector comes with an emulator, but those of the identical series (FTSH series) released from Samtec, Inc. are also available.
FTSH-110-01-[*]-[*][*]-[*][*]
[*] of the part number indicates a connector option. When purchasing, choose a suitable option according to its usage. For details specifications, please visit Samtec, Inc. website.
Communication Connector attached to an Emulator
Part Nnumber |
Note |
---|---|
FTSH-110-01-L-DV-K | Surface mount type with keying shroud |
Communication Connector Pin Assignment Table
Connector Pin No. | Signal Name |
---|---|
1 | EI_SYNCLK |
3 | EO_MCUDATA |
5 | EI_PODDATA |
7 | EO_MCUREQ |
9 | EI_PODREQ |
11 | N.C (notes-1) |
13 | N.C (notes-1) |
15 | EI_REFCLK |
17 | EO_COMRESET |
19 | DVCC3A |
Connector Pin No. | Signal Name |
---|---|
2 | GND |
4 | GND |
6 | GND |
8 | GND |
10 | GND |
12 | GND |
14 | GND |
16 | GND |
18 | GND |
20 | DVCC3A |
(Notes-1)
(Notes) For the MCU pin numbers, signal names and connection method, be sure to see a data sheet for the target MCU.
Note for Layout of Communication Cable Connector
To monitor the waveforms of the EI_TRGIN and EO_TRGOUT signals, prepare external I/O pins on the target system as required. The following figure shows the cable pull-out direction and connector pin position, when the emulator is connected. To design the board, take into account interference with other parts at the time of connecting the communication cable. For a connector size, please visit Samtec, Inc. website.
Points of concern in signal wiring
To monitor the waveforms of the EI_TRGIN and EO_TRGOUT signals, prepare external I/O pins on the target system as required.
Each debug communication signal should be connected by locating the communication cable connecor within 10 cm (4 inches) from the MCU. Especially, the EI_SYNCLK, EO_MCUDATA, EI_PODDATA, EO_MCUREQ and EI_PODREQ signals must be connected with the same length of wire. If the wire length is longer than 10 cm, or it varies greately among these signals, proper operation may not be obtained.
All the DVCC3A and GND lines between the MCU and the communication cable connector should be as short as possible (preferably within 5 cm, within 10 cm at the longest). If the DVCC3A and GND lines are long, proper operation may not be ontained.
The communication connector should be connected directly to the MCU pattern. If a dumping resistor is inserted between the MCU and the communication cable connector, be careful of signal delays.
About Emulation Operating Voltage/Frequency
Limitation of the On-Chip Debug Emulation
Precautions for USB Connection
Communication Cable
The communication cable is used to connect the emulator or the FLASH Writer to the target system. It is pre-plugged to the emulator or the FLASH Writer.
The communication cable is available from Samtec, Inc. For detailed specifications, please visit Samtec, Inc. website.
The recommended product can also be purchased from the following agencies.
Name | Part Number | Remark |
---|---|---|
Communication cable | FFSD-10-D-07.00-01-N | Pre-plugged to the emulator or the FLASH Writer |
Communication Connector
The communication connector is used to connect the emulator or the FLASH Writer to the target system. The part numbers shown below are examples. Other mount types, such as through-hole, and other mating options are also available to meet the specific needs of each customer.
The communication connector is available from Samtec, Inc. For detailed specifications, please visit Samtec, Inc. website.
The recommended product can also be purchased from the following agencies.
Name | Part Number | Remark |
---|---|---|
Communication connector | FTSH-110-01-L-DV-K | Surface mount type with keying shroud. Each emulator comes with one communication connector. |