WCSP4G

In developing your designs, please ensure the datasheet.

WCSP4Gpackage
Toshiba Code S-XFBGA4-0101-0.35-003
Mounting Surface Mount
Pins 4
Width×Length×Height
(mm)		 0.645×0.645×0.465
3D Model STEP
Package Dimensions (mm)
/
Land pattern dimensions for
reference only (mm)
Packing Method Embossed Tape
Packing Name TE85L / L
Minimum Quantity 5000 pcs/Reel
Tape Width (mm) 8
Tape Dimensions (mm)
/
Reel Dimensions (mm)

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

  • 3D model(.stp)： 3D model Data in STEP Format
Jump to Package & Packing Information
A new window will open