Display Interface Bridge ICs

Toshiba display interface bridge has various display interfaces to facilitate not only the design for feature-rich mobile equipment , but also the design for consumer and industrial equipment realizing superb picture quality.

Lineup

DisplayPort™ interface bridge

Part number
Package Image






Input (1)MIPI® DSI 1.01
(2)MIPI® DPI 2.0
(3)MIPI® DSI 1.01		 MIPI® DSI 1.02 VESA Embedded
Display Port
(eDP) ver1.4
Output (1)(2)VESA DisplayPort™ 1.1a
(3)MIPI® DPI 2.0		 VESA DisplayPort™ 1.1a MIPI® DSI 1.02

Resolution

 (1)(2)WUXGA 1920x1200 @24bits
(3)WXGA 1280x800 @24bits ,100MHz PCLK		 QSXGA
2560×2048
@24bit		 QSXGA
2560×2048
@24bit		 4K Ultra HD
4096×2048, 3840×2160
@24bit
Package dimensions BGA81
5 mm × 5 mm,
0.5 mm pitch		 BGA80
7 mm × 7 mm,
0.65 mm pitch		 BGA100
5 mm × 5 mm,
0.4 mm pitch		 BGA80
7 mm × 7 mm,
0.65 mm pitch		 BGA65
5 mm × 5 mm,
0.5 mm pitch
Status Mass production

LVDS interface bridge

Part
number
Package
Image





Input
 MIPI® DSI 1.01
Output LVDS
Single Link
( 5 pairs/ link )		 LVDS
Dual Link
( 5 pairs/ link )		 LVDS
Single Link
( 5 pairs/ link )		 LVDS
Dual Link
( 5 pairs/ link )
Link
Speed		 DSI Up to
1 Gbps/lane
 Up to
1 Gbps/lane		 Up to
1 Gbps/lane		 Up to
1 Gbps/lane
LVDS
 135 MHz 135 MHz 135 MHz 135 MHz
Resolution UXGA
1600×1200
@24bit		 WUXGA
1920×1200
@24bit		 UXGA
1600×1200
@24bit		 WUXGA
1920×1200
@24bit
Video
Format		 DSI  RGB565,RGB666,
RGB666
(loosely packed)
RGB888
LVDS RGB565, RGB666, RGB888
I2C
(100K/400KHz)		 Slave/Master
Package
dimensions		 BGA49
5 mm × 5 mm,
0.65 mm pitch		 BGA64
6 mm × 6 mm,
0.65 mm pitch		 BGA49
5 mm × 5 mm,
0.65 mm pitch		 BGA64
6 mm × 6 mm,
0.65 mm pitch
Status Mass production

MIPI® DSI interface bridge

Part number
Package Image





Input (1)MIPI® DSI 1.01
(2)MIPI® DPI 2.0
(3)MIPI® DSI 1.01		 RGB
Output (1)(2)VESA DisplayPort™ 1.1a
(3)MIPI® DPI 2.0		 MIPI® DSI 1.02

Maximum Support Resolution

 (1)(2)WUXGA 1920x1200 @24bits
(3)WXGA 1280x800 @24bits ,100MHz PCLK		 WUXGA
1920×1200
@24bit
Package dimensions BGA81
5 mm × 5 mm,
0.5 mm pitch		 BGA80
7 mm × 7 mm,
0.65 mm pitch		 BGA72
4.5mm×4.5 mm
0.4 mm pitch		 BGA80
7 mm × 7 mm,
0.65 mm pitch
Status Mass production

Related information

Toshiba offers Display Interface Bridge ICs capable of translating video stream data from host to external display devices. Our components allow for high-performance between host processor and display module. With the increasing necessity for display interface bridges, Toshiba manufactures bridge ICs capable of connecting between MIPI®-DSI, DisplayPort™ and LVDS.

MIPI® DSI to LVDS display bridge is optimized for mobile devices using a Host processor with MIPI DSI (Display Serial Interface) connectivity. The bridge IC functions as a protocol bridge enabling the video data stream from the Host processor DSI link to drive LVDS display panels.

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* MIPI® is registered service marks of MIPI Alliance, Inc.
* Other company names, product names, and service names may be trademarks of their respective companies.

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