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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Is it possible to use the E-Pad (metal frame) exposed on the surface of a high-voltage IPD as a conductive pin?
No. The DIP26 and HSSOP31 packages for our high-voltage IPDs have an E-Pad (metal frame) exposed on the package surface. It must not be used as a conductive pin.
The circuit, operation and usage of the high-voltage IPD are also described in "High voltage intelligent power device application note“. Please also refer to this document.