Feature | BR+LE dual / Small BGA Package / LE Secure Connection supoort |
---|---|
Automotive Support | – |
Bluetooth Category | Bluetooth® dual-mode |
Bluetooth Core spec. | 4.2 |
Embedded Profiles | GATT / SMP / SPP |
Interfacing | I2C / SPI / UART |
User RAM Size (KB) | – |
User Flash Size (KB) | – |
Function | ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode |
Other Functions | LE secure connection |
RoHS Compatible Product(s) (#) | Available |
Status | Under mass production |
Toshiba Package Name | P-TFBGA64-0505-0.50 |
---|---|
Package name | BGA |
Pins | 64 |
Mounting | Surface Mount |
Package size | 5.0 mm x 5.0 mm |
Pin pitch | 0.5 mm |
Please refer to the link destination to check the detailed size.
Characteristics | Symbol | Condition | Value | Unit |
---|---|---|---|---|
Operating Temperature (Max) | Topr | - | 85 | ℃ |
Operating Temperature (Min) | Topr | - | -40 | ℃ |
Power supply voltage (Max) | - | - | 3.6 (*2) | V |
Power supply voltage (Min) | - | - | 1.7 (*2) | V |
Current Consumption in RX Active mode (peak) | IRX | (3.3V) | 63 | mA |
Current Consumption in TX Active mode (peak) | ITX | (3.3V) | 63 | mA |
Current Consumption in Sleep mode | ISleep | - | 30 | μA |
Transmit Power(Max) | PTrans | - | 1 | dBm |
Receiver Sensitivity | - | - | -91 | dBm |
(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.