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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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TC35661SBG-551

EOL announced

Bluetooth® IC

Description

Feature BR+LE dual / Small BGA Package / LE Secure Connection supoort
Automotive Support N/A
Bluetooth Category Bluetooth® dual-mode
Bluetooth Core spec. 4.2
Embedded Profiles GATT / SMP / SPP
Interfacing I2C / SPI / UART
User RAM Size (KB) N/A
User Flash Size (KB) N/A
Function ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode
Other Functions LE secure connection
RoHS Compatible Product(s) (#) Available
Assembly bases Japan
Status Under mass production

Package Information

Toshiba Package Name P-TFBGA64-0505-0.50
Package name BGA
Pins 64
Package size 5.0 mm x 5.0 mm
Pin pitch 0.5 mm

 Please refer to the link destination to check the detailed size.

Electrical Characteristics

Characteristics Symbol Condition Value Unit
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 (*2) V
Power supply voltage (Min) - - 1.7 (*2) V
Current Consumption in RX Active mode (peak) IRX (3.3V) 63 mA
Current Consumption in TX Active mode (peak) ITX (3.3V) 63 mA
Current Consumption in Sleep mode ISleep - 30 μA
Transmit Power(Max) PTrans - 1 dBm
Receiver Sensitivity - - -91 dBm

(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.

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Notes

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