EOL announced

Bluetooth® IC


Feature BR+LE dual / Small BGA Package / LE Secure Connection supoort
Automotive Support
Bluetooth Category Bluetooth® dual-mode
Bluetooth Core spec. 4.2
Embedded Profiles GATT / SMP / SPP
Interfacing I2C / SPI / UART
User RAM Size (KB)
User Flash Size (KB)
Function ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode
Other Functions LE secure connection
RoHS Compatible Product(s) (#) Available
Status Under mass production

Package Information

Toshiba Package Name P-TFBGA64-0505-0.50
Package name BGA
Pins 64
Mounting Surface Mount
Package size 5.0 mm x 5.0 mm
Pin pitch 0.5 mm

 Please refer to the link destination to check the detailed size.

Electrical Characteristics

Characteristics Symbol Condition Value Unit
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 (*2) V
Power supply voltage (Min) - - 1.7 (*2) V
Current Consumption in RX Active mode (peak) IRX (3.3V) 63 mA
Current Consumption in TX Active mode (peak) ITX (3.3V) 63 mA
Current Consumption in Sleep mode ISleep - 30 μA
Transmit Power(Max) PTrans - 1 dBm
Receiver Sensitivity - - -91 dBm

(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.


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