Extensive package lineup
Toshiba offers a wide choice of products in packages ranging from general-purpose SMV (SOT-25) packages to ultra-compact WCSP packages and SDFN4 packages. For applications such as modules that require compact and thin LDOs, Toshiba has a lineup of thin packages with an optimum thickness of 0.33 mm max.
For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.
Package Search
- SOT-553 (ESV)
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Package Size
W : 1.6 mm 0.063 inch L : 1.6 mm 0.063 inch H : 0.55 mm 0.022 inch
- SOT-353F (UFV)
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Package Size
W : 2.0 mm 0.079 inch L : 2.1 mm 0.083 inch H : 0.7 mm 0.028 inch
All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.
Related information
Queries about purchasing, sampling and IC reliability
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