Extensive package lineup

Extensive package lineup

Toshiba offers a wide choice of products in packages ranging from general-purpose SMV (SOT-25) packages to ultra-compact WCSP packages and SDFN4 packages. For applications such as modules that require compact and thin LDOs, Toshiba has a lineup of thin packages with an optimum thickness of 0.33 mm max.

For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.

Package Search


All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.


Technical inquiry

Contact us

Contact us

Frequently Asked Questions


Queries about purchasing, sampling and IC reliability

Stock Check & Purchase


Disclaimer for External Link
Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.
A new window will open