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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Extensive package lineup

Toshiba offers a wide choice of products in packages ranging from general-purpose SMV (SOT-25) packages to ultra-compact WCSP packages and SDFN4 packages. For applications such as modules that require compact and thin LDOs, Toshiba has a lineup of thin packages with an optimum thickness of 0.33 mm max.

For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.

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All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

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