Extensive package lineup

Extensive package lineup

Toshiba offers a wide choice of products in packages ranging from general-purpose SMV (SOT-25) packages to ultra-compact WCSP packages and SDFN4 packages. For applications such as modules that require compact and thin LDOs, Toshiba has a lineup of thin packages with an optimum thickness of 0.33 mm max.

For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.

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All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.


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Click this link to check inventory of TOSHIBA parts available at those distributors of Toshiba America Electronic Components, Inc. ("TAEC") who participate in netCOMPONENTS electronic components sourcing database. Please note that TAEC is providing this link solely as a convenience. All quantities listed in inventory are subject to change and information provided in this page does not guarantee availability of product(s), please check with Distributor before relying on the quantities listed. In order to guarantee availability you must place an order with one of Toshiba’s distributors.
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