For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.