Extensive package lineup

Extensive package lineup

Toshiba offers a wide choice of products in packages ranging from general-purpose SMV (SOT-25) packages to ultra-compact WCSP packages and SDFN4 packages. For applications such as modules that require compact and thin LDOs, Toshiba has a lineup of thin packages with an optimum thickness of 0.33 mm max.

For small and thin mobile devices and modular equipment, 0.645 mm x 0.645 mm height 0.33 mm WCSP4F packages and 1.2 mm x 0. 8 mm height 0.33 mm WCSP6F packages are recommended. Toshiba is also the first in the world to mass-produce a 1.2 x 1.2 mm DFN5B, which is very popular as a camera power source for smartphones in molded packages. SMVs (SOT-25), which are easy to handle for consumer products, are popular. These packages are produced in Japan and Thailand with high quality and stability.

Package Search

unit:
DFN4

Package Size

W : 1.0 mm 0.039 inch
L : 1.0 mm 0.039 inch
H : 0.58 mm 0.023 inch
WCSP4F

Package Size

W : 0.645 mm 0.025 inch
L : 0.645 mm 0.025 inch
H : 0.33 mm 0.013 inch
SDFN4

Package Size

W : 0.8 mm 0.031 inch
L : 0.8 mm 0.031 inch
H : 0.38 mm 0.015 inch
WCSP4E

Package Size

W : 0.645 mm 0.025 inch
L : 0.645 mm 0.025 inch
H : 0.43 mm 0.017 inch
WCSP4

Package Size

W : 0.79 mm 0.031 inch
L : 0.79 mm 0.031 inch
H : 0.5 mm 0.020 inch
SOT-553 (ESV)

Package Size

W : 1.6 mm 0.063 inch
L : 1.6 mm 0.063 inch
H : 0.55 mm 0.022 inch
SOT-353F (UFV)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.7 mm 0.028 inch
SOT-25 (SMV)

Package Size

W : 2.9 mm 0.11 inch
L : 2.8 mm 0.11 inch
H : 1.1 mm 0.043 inch
DFN5B

Package Size

W : 1.2 mm 0.047 inch
L : 1.2 mm 0.047 inch
H : 0.38 mm 0.015 inch
WCSP6F

Package Size

W : 1.2 mm 0.047 inch
L : 0.8 mm 0.031 inch
H : 0.33 mm 0.013 inch

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

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