Over recent years, there has been a lot of talk throughout the power electronics industry about the exciting performance attributes offered by silicon carbide (SiC). Though there is plenty of information available on this subject, finding a way of translating it into what this actually means for engineers’ designs has still proved difficult. Consequently, many engineers are still reluctant to migrate from the conventional silicon (Si) technology that they are already very familiar with. Unfortunately that means that they are missing out.
For this reason, Toshiba has decided to address the problem. It has launched a series of short flyers that each look at a different facet of SiC. This means that, rather than being bombarded with too much information, engineers can access bite-sized chucks that cover the particular subjects that are most relevant to them. Using these ‘SiC Snacks’, they will be able to get a better understanding of what the outcomes of adopting wide bandgap technology will be - how they can enhance their power systems and what the benefits will be to their end customers.
The first 5 SiC Snacks are available to download here:
Download the snack you're interested in, or download them all together.