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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Toshiba load switch ICs incorporate an output transistor and an output driver circuit, and are much smaller than the conventional discrete configuration. The package lineup focuses on ultra-small products of the 1 mm-neck class. In particular, the package lineup provides products that are suitable for use in portable devices that require space saving.

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All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

WCSP types are recommended for mobile and modular devices that require small and thin shapes. SMVs (SOT-25), which are easy to handle in consumer products, are also popular. Refer to the above links for the product lineup for each package. These packages are produced in Japan and Thailand with high quality and stability.

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