Extensive package lineup
Toshiba load switch ICs incorporate an output transistor and an output driver circuit, and are much smaller than the conventional discrete configuration. The package lineup focuses on ultra-small products of the 1 mm-neck class. In particular, the package lineup provides products that are suitable for use in portable devices that require space saving.
- WCSP4D
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Package Size
W : 0.79 mm 0.031 inch L : 0.79 mm 0.031 inch H : 0.55 mm 0.022 inch
- WCSP4C
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Package Size
W : 0.9 mm 0.035 inch L : 0.9 mm 0.035 inch H : 0.5 mm 0.020 inch
- DFN4A
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Package Size
W : 1.2 mm 0.047 inch L : 1.2 mm 0.047 inch H : 0.38 mm 0.015 inch
- SOT-25 (SMV)
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Package Size
W : 2.9 mm 0.11 inch L : 2.8 mm 0.11 inch H : 1.1 mm 0.043 inch
- WCSP6E
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Package Size
W : 1.2 mm 0.047 inch L : 0.8 mm 0.031 inch H : 0.55 mm 0.022 inch
- WCSP6C
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Package Size
W : 1.5 mm 0.059 inch L : 1.0 mm 0.039 inch H : 0.5 mm 0.020 inch
- WCSP9
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Package Size
W : 1.5 mm 0.059 inch L : 1.5 mm 0.059 inch H : 0.54 mm 0.021 inch
- WCSP16C
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Package Size
W : 1.9 mm 0.075 inch L : 1.9 mm 0.075 inch H : 0.54 mm 0.021 inch
All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.
WCSP types are recommended for mobile and modular devices that require small and thin shapes. SMVs (SOT-25), which are easy to handle in consumer products, are also popular. Refer to the above links for the product lineup for each package. These packages are produced in Japan and Thailand with high quality and stability.
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