Toshiba load switch ICs incorporate an output transistor and an output driver circuit, and are much smaller than the conventional discrete configuration. The package lineup focuses on ultra-small products of the 1 mm-neck class. In particular, the package lineup provides products that are suitable for use in portable devices that require space saving.
|W||:||2.9 mm 0.11 inch|
|L||:||2.8 mm 0.11 inch|
|H||:||1.1 mm 0.043 inch|
All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.
WCSP types are recommended for mobile and modular devices that require small and thin shapes. SMVs (SOT-25), which are easy to handle in consumer products, are also popular. Refer to the above links for the product lineup for each package. These packages are produced in Japan and Thailand with high quality and stability.