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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Microcomputer

Clicking on product's category allows you to see Microcomputer Part Naming Conventions.

Example 1) TMP89FS60xxUG

Example 1 of Microcomputer

1. Toshiba microcontrollers

2. Microcontroller core
 89: 870/C1  92: 900/H1

3. ROM type
 C: Mask  E: EEPROM  F: Flash  P: OTP

4. ROM size

  1 2 3 4 6 8 C H K M N P S U W F Y Z D
KB 1 2 3 4 6 8 12 16 24 32 40 48 60/64 96 124/128 192 256 384 512

5. Microcontroller subtype

6. Microcontroller revision

7. Automotive quality grade
 R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
 I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C

8. Package
 QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
 XBG: Plastic ball grid array (BGA); dry-packed
 WBG: Wafer-level chip size package (WCSP); dry-packed
 UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
 MG, DMG: Plastic small-outline package (SOP); dry-packed
 NG: Plastic shrink dual-in-line package (SDIP)

Example 2) TMPM369FDxxXBG

Example 2 of Microcomputer

1. Toshiba microcontrollers

2. Microcontroller core
 M0: 00  M3: 03  M4: 04  R4: 04R  A9: 09  19A: 19A, 19A/H1

3. Microcontroller subtype

4. ROM type
 C: Mask  F: Flash

5. ROM size

  H M R S W Y Z D E 10 15 20
KB 16 32 56 64 128 256 384 512 768 1024 1536 2048

6. Microcontroller revision

7. Automotive quality grade
 R: Grade A, -40°C to +85°C T: Grade A, -40°C to +125°C
 I: Grade B, -40°C to +85°C S: Grade B, -40°C to +125°C

8. Package
 QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
 XBG: Plastic ball grid array (BGA, FBGA, TFBGA, VFBGA); dry-packed
 UG, FG, DFG: Plastic quad flat package (QFP, LQFP, HQFP); dry-packed
 DMG: Plastic small-outline package (SOP); dry-packed
 NG: Plastic shrink dual-in-line package (SDIP)

Example 3) TMPM3H4FWxUG

Example 3 of Microcomputer

1. The identification of Toshiba microcontrollers.

2. Core
 M4: ARM Cortex-M4  M3: ARM Cortex-M3  M0: ARM Cortex-M0

3. Product Group
 TXZ family is written in alphabet and TX family is numbers.
 H: For General-purpose/Consumer electronic equipment
 K: For Motor/Inverter control industrial equipment(MCU+AMP/COMP)
 G: For OA/Digital equipment/industrial equipment
 E: For Robotics, precision instruments control
 P: For Healthcare / Battery equipment

4. Pin Count
 Within the same group, numbers and alphabets may be used properly depending on the difference in SPEC even with the same pin count.

  Pin Count
0 G ≤32Pins
1 H 33Pins≤, ≤44Pins
2 J 45Pins≤, ≤48Pins
3 K 49Pins≤, ≤52Pins
4 L 53Pins≤, ≤64Pins
5 M 65Pins≤, ≤80Pins
6 N 81Pins≤, ≤100Pins
7 P 101Pins≤, ≤128Pins
8 Q 129Pins≤, ≤144Pins
9 R 145Pins≤, ≤176Pins
A S 177Pins≤, ≤200Pins
B T 201Pins≤, ≤224Pins
C U 225Pins≤, ≤250Pins
D V 251Pins≤, ≤300Pins

5. ROM type
 F: Flash C: Mask

6. ROM size

  M P S U W Y Z D E 10 15 20 40 80
KB 32 48 64 96 128 256 384 512 768 1024 1536 2048 4096 8192

7. Revision

8. Package
 QG: Plastic shrink quad outline non-leaded package; dry-packed
 UG, DUG, FG, DFG: Plastic quad flat package; dry-packed
 MG, DMG: Plastic small-outline package ; dry-packed
 XBG: Plastic ball grid array ; dry-packed

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