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To realize MBD, we provide automotive semiconductor models that are compatible with customers' design environments. We will introduce various SPICE models, thermal analysis, and an overview of our efforts in noise verification.

Toshiba has launched four products of TB67Z83xxFTG Series three-phase gate driver ICs and four products of TB67Z85xxFTG Series three-phase gate driver ICs for three-phase brushless DC motors used for consumer and industrial equipment such as power tools, cleaners, industrial robots, etc.

Low-voltage and high-speed switching photorelay, TLP3450S contributes to faster product test times for semiconductor testers.

The use of a proprietary CMOS process enables high power input in a small package, contributing to the miniaturization of devices. Low insertion loss and low current consumption contribute to improved equipment efficiency.

Introducing a new reference design for a 1U sized power supply with DC 12 V of output voltage and 1.6 kW (max) of output power, suitable for data center servers that require reduced power consumption.

The new LDO regulator contributes to reduce the power consumption of equipment. Drop-out performance and load transient response are improved compared to our existing-product.

Mass production of of 600V small intelligent power device for brushless DC motor drive applications such as air conditioners, air purifiers, and pumps.

By bringing the latest technology advances to high performance power semiconductors, Toshiba Electronic Devices and Storage Corporation is boosting energy conservation in all types of electrical equipment and contributing to a carbon-neutral world.

Mass production of four photocouplers for high-speed communications that can operate normally even when the rise time and fall time are slow.

Toshiba commercialized TLP3412SRLA with low operating voltage for 1.8 V system FPGA, High operating temperature ratings for securing equipment temperature margins and Small package S-VSON4T for high density mounting

Toshiba just released and begun mass production of TLP241BP, the first DIP4 package photorelay^{[Note 1]} with OFF-state output terminal voltage 80 V, over temperature protection and over voltage protection functions.

We have released a photovoltaic output photocoupler for solid state relay for automotive equipment with improved the minimum open voltage.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has created the Simplified CFD Model that is suitable for cooling simulations, focusing on MOSFET, and has started releasing this model.

Suitable for applications of equipment requires power loss reduction and downsizing

Provide system solutions utilizing high-power electronic technology

SiC MOSFETs support downsizing and low-loss power supplies