-
My ToshibaSemicon
- General Top View
-
SEMICONDUCTOR View
-
Applications
Body Electronics
xEV
In-Vehicle Infotainment
Advanced Driver-Assistance Systems (ADAS)
Chassis
Infrastructure
BEMS/HEMS
Factory Automation
Commercial Equipment
IoT Equipment
Healthcare
Wearable Device
Mobile
Computer Peripherals
-
Products
Products
-
Design & Development
-
Knowledge
- Where To Buy View
-
- STORAGE View
- COMPANY View
- Part Number Search
- Cross Reference Search
- Keyword Search
- Parametric Search
- Stock Check & Purchase
This webpage doesn't work with Internet Explorer. Please use the latest version of Google Chrome, Microsoft Edge, Mozilla Firefox or Safari.
require 3 characters or more.
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
require 3 characters or more.
Microcontroller
Clicking on product's category allows you to see Microcontroller Part Naming Conventions.
Example 1) TMP89FS60xxUG
1. Toshiba microcontrollers
2. Microcontroller core
89: 870/C1 92: 900/H1
3. ROM type
C: Mask E: EEPROM F: Flash P: OTP
4. ROM size
| 1 | 2 | 3 | 4 | 6 | 8 | C | H | K | M | N | P | S | U | W | F | Y | Z | D | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| KB | 1 | 2 | 3 | 4 | 6 | 8 | 12 | 16 | 24 | 32 | 40 | 48 | 60/64 | 96 | 124/128 | 192 | 256 | 384 | 512 |
5. Microcontroller subtype
6. Microcontroller revision
7. Automotive quality grade
R: Grade A, －40°C to +85°C T: Grade A, －40°C to +125°C
I: Grade B, －40°C to +85°C S: Grade B, －40°C to +125°C
8. Package
QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
XBG: Plastic ball grid array (BGA); dry-packed
WBG: Wafer-level chip size package (WCSP); dry-packed
UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
MG, DMG: Plastic small-outline package (SOP); dry-packed
NG: Plastic shrink dual-in-line package (SDIP)
Example 2) TMPM369FDxxXBG
1. Toshiba microcontrollers
2. Microcontroller core
M0: 00 M3: 03 M4: 04 R4: 04R A9: 09 19A: 19A, 19A/H1
3. Microcontroller subtype
4. ROM type
C: Mask F: Flash
5. ROM size
| H | M | R | S | W | Y | Z | D | E | 10 | 15 | 20 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| KB | 16 | 32 | 56 | 64 | 128 | 256 | 384 | 512 | 768 | 1024 | 1536 | 2048 |
6. Microcontroller revision
7. Automotive quality grade
R: Grade A, －40°C to +85°C T: Grade A, －40°C to +125°C
I: Grade B, －40°C to +85°C S: Grade B, －40°C to +125°C
8. Package
QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
XBG: Plastic ball grid array (BGA, FBGA, TFBGA, VFBGA); dry-packed
UG, FG, DFG: Plastic quad flat package (QFP, LQFP, HQFP); dry-packed
DMG: Plastic small-outline package (SOP); dry-packed
NG: Plastic shrink dual-in-line package (SDIP)
Example 3) TMPM3H4FWxUG
1. The identification of Toshiba microcontrollers.
2. Core
M4: ARM Cortex-M4 M3: ARM Cortex-M3 M0: ARM Cortex-M0
3. Product Group
TXZ family is written in alphabet and TX family is numbers.
H: For General-purpose/Consumer electronic equipment
K: For Motor/Inverter control industrial equipment(MCU+AMP/COMP)
G: For OA/Digital equipment/industrial equipment
E: For Robotics, precision instruments control
P: For Healthcare / Battery equipment
4. Pin Count
Within the same group, numbers and alphabets may be used properly depending on the difference in SPEC even with the same pin count.
| Pin Count | ||
|---|---|---|
| 0 | G | ≤32Pins |
| 1 | H | 33Pins≤, ≤44Pins |
| 2 | J | 45Pins≤, ≤48Pins |
| 3 | K | 49Pins≤, ≤52Pins |
| 4 | L | 53Pins≤, ≤64Pins |
| 5 | M | 65Pins≤, ≤80Pins |
| 6 | N | 81Pins≤, ≤100Pins |
| 7 | P | 101Pins≤, ≤128Pins |
| 8 | Q | 129Pins≤, ≤144Pins |
| 9 | R | 145Pins≤, ≤176Pins |
| A | S | 177Pins≤, ≤200Pins |
| B | T | 201Pins≤, ≤224Pins |
| C | U | 225Pins≤, ≤250Pins |
| D | V | 251Pins≤, ≤300Pins |
5. ROM type
F: Flash C: Mask
6. ROM size
| M | P | S | U | W | Y | Z | D | E | 10 | 15 | 20 | 40 | 80 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| KB | 32 | 48 | 64 | 96 | 128 | 256 | 384 | 512 | 768 | 1024 | 1536 | 2048 | 4096 | 8192 |
7. Revision
8. Package
QG: Plastic shrink quad outline non-leaded package; dry-packed
UG, DUG, FG, DFG: Plastic quad flat package; dry-packed
MG, DMG: Plastic small-outline package ; dry-packed
XBG: Plastic ball grid array ; dry-packed