Microcontroller

Clicking on product's category allows you to see Microcontroller Part Naming Conventions.

Example 1)　TMP89FS60xxUG

Example 1 of Microcontroller
Example 1 of Microcontroller

1. Toshiba microcontrollers

2. Microcontroller core
　89: 870/C1　　92: 900/H1

3. ROM type
　C: Mask　　E: EEPROM　　F: Flash　　P: OTP

4. ROM size

  1 2 3 4 6 8 C H K M N P S U W F Y Z D
KB 1 2 3 4 6 8 12 16 24 32 40 48 60/64 96 124/128 192 256 384 512

5. Microcontroller subtype

6. Microcontroller revision

7. Automotive quality grade
　R: Grade A, －40°C to +85°C　T: Grade A, －40°C to +125°C
　I: Grade B, －40°C to +85°C　S: Grade B, －40°C to +125°C

8. Package
　QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
　XBG: Plastic ball grid array (BGA); dry-packed
　WBG: Wafer-level chip size package (WCSP); dry-packed
　UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
　MG, DMG: Plastic small-outline package (SOP); dry-packed
　NG: Plastic shrink dual-in-line package (SDIP)

Example 2)　TMPM369FDxxXBG

Example 2 of Microcontroller
Example 2 of Microcontroller

1. Toshiba microcontrollers

2. Microcontroller core
　M0: 00 　M3: 03 　M4: 04　 R4: 04R 　A9: 09 　19A: 19A, 19A/H1

3. Microcontroller subtype

4. ROM type
　C: Mask　　F: Flash

5. ROM size

  H M R S W Y Z D E 10 15 20
KB 16 32 56 64 128 256 384 512 768 1024 1536 2048

6. Microcontroller revision

7. Automotive quality grade
　R: Grade A, －40°C to +85°C　T: Grade A, －40°C to +125°C
　I: Grade B, －40°C to +85°C　S: Grade B, －40°C to +125°C

8. Package
　QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
　XBG: Plastic ball grid array (BGA, FBGA, TFBGA, VFBGA); dry-packed
　UG, FG, DFG: Plastic quad flat package (QFP, LQFP, HQFP); dry-packed
　DMG: Plastic small-outline package (SOP); dry-packed
　NG: Plastic shrink dual-in-line package (SDIP)

Example 3)　TMPM3H4FWxUG

Example 3 of Microcontroller
Example 3 of Microcontroller

1. The identification of Toshiba microcontrollers.

2. Core
　M4: ARM Cortex-M4 　M3: ARM Cortex-M3 　M0: ARM Cortex-M0

3. Product Group
　TXZ family is written in alphabet and TX family is numbers.
　H: For General-purpose/Consumer electronic equipment
　K: For Motor/Inverter control industrial equipment(MCU+AMP/COMP)
　G: For OA/Digital equipment/industrial equipment
　E: For Robotics, precision instruments control
　P: For Healthcare / Battery equipment

4. Pin Count
　Within the same group, numbers and alphabets may be used properly depending on the difference in SPEC even with the same pin count.

  Pin Count
0 G ≤32Pins
1 H 33Pins≤, ≤44Pins
2 J 45Pins≤, ≤48Pins
3 K 49Pins≤, ≤52Pins
4 L 53Pins≤, ≤64Pins
5 M 65Pins≤, ≤80Pins
6 N 81Pins≤, ≤100Pins
7 P 101Pins≤, ≤128Pins
8 Q 129Pins≤, ≤144Pins
9 R 145Pins≤, ≤176Pins
A S 177Pins≤, ≤200Pins
B T 201Pins≤, ≤224Pins
C U 225Pins≤, ≤250Pins
D V 251Pins≤, ≤300Pins

5. ROM type
　F: Flash　C: Mask

6. ROM size

  M P S U W Y Z D E 10 15 20 40 80
KB 32 48 64 96 128 256 384 512 768 1024 1536 2048 4096 8192

7. Revision

8. Package
　QG: Plastic shrink quad outline non-leaded package; dry-packed
　UG, DUG, FG, DFG: Plastic quad flat package; dry-packed
　MG, DMG: Plastic small-outline package ; dry-packed
　XBG: Plastic ball grid array ; dry-packed

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