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MOSFET Product lineup

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12V - 300V MOSFETs

Highlight

  • The U-MOSⅧ-H Series

    The U-MOSⅧ-H Series provides the industry's most extensive portfolio of low on-resistance MOSFETs and the best-in-class trade-off between on-resistance and capacitance. Because of its fast operation, the U-MOSⅧ-H Series helps reduce switching loss, making it possible to increase the power supply efficiency. The U-MOSⅧ-H Series is available with a VDSS of 30 to 250 V and in various packages, including a state-of-the-art package with double-sided cooling capability.

  • Latest U-MOSⅨ-H Series

    The U-MOSⅨ-H Series is specifically designed for synchronous rectification applications, including the secondary sie of isolated switching power supplies. It provides an improved Qoss*1performance, one of the causes of power loss of synchronous rectification. The U-MOSⅨ-H Series provides 27% lower Ron•Qoss, the trade-off characteristics between on-resistance (Ron) and Qoss, than the latest products from other semiconductor vendors*2. Since Ron has a significant impact on Qoss, Toshiba will extend the U-MOSⅨ-H portfolio with MOSFETs having ultra-low Ron in order to supplement the lineup of the U-MOSⅧ-H Series.

*1 Qoss: Output charge (drain-source charge)

*2  When 40-V MOSFETs in an equivalent package are compared (as of December 2014, as surveyed by Toshiba)

  • Low Driving Voltage and Low Ron

    Toshiba can realize low Ron even for the low voltage products by the best-in-class process and low power consumption, following up the down trend of system power.

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  • Packaging Trends for 12-300V MOSFETs

    Packaging Trends for 12-300V MOSFETs

    TOSHIBA has various packagies for each purpose from very small package like 0.8x0.6mm to high radiation package.

  • Packaging feature for type of semi power

    Packaging feature for type of semi power

    Even the mounting areas are the same between SOT-23F and SOT-23, chip pn-board capability of SOT-23F is higher than SOT-23. Therefore SOT-23F realizes the higher performance than SOT-23.

  • Packaging Trends for Power MOSFETs

    • Heat is removed from both the top and bottom surfaces.
    • The top metal plate is connected to the source.
      (The source cannot serve as an electrode to conduct electric current. Use it for heat removal purposes.)
    • Same footprint dimensions as for existing SOP Advance
      (SOP Advance can be replaced by the new package without modifying an existing PCB layout.)

  • Packaging for high current

    • Increase current density and Ron due to Cu clamp
    • Footprint of high current package is the same with general package

    Packaging for high current

    High Current Type General Type
    TO-220SM(W) TO-220SM(D2PAK)
    DPAK+ New PW-Mold
    SOP Advance SOP-8

    TO-220SM(W)、DPAK+、SOP Advance

Lineups

Documents

Whitepaper

Whitepaper
Name outline Date of issue
Evolution of Devices Supporting Power
Electronics and Expansion of Technologies for
Mounting, Circuits, and Application to Products
8/2017

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Optimising power design through MOSFET efficiency and intergration 8/2017

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Cordless Power Tools: Delivering High Output Power, Extended Operation and Smaller Form Factors 9/2017

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Dual side cooling package DSOP Advance: Thermal conductance innovation for power-MOSFET 8/2017

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Application note

Application note
Name outline Date of issue
describes how to reduce the chip temperature of discrete semiconductor devices. 12/2017
Describes planar, trench and super-junction power MOSFETs 11/2016
Describes the absolute maximum ratings, thermal impedance and safe operating area of power MOSFETs 11/2016
Describes electrical characteristics shown in datasheets 11/2016
Describes how to select power MOSFETs, temperature characteristics, the impacts of wires and parasitic oscillation, avalanche ruggedness, snubber circuits and so on 11/2016
Describes thermal equivalent circuits, examples of channel temperature calculation and considerations for heatsink attachment 2/2017
Describes the guidelines for the design of a gate driver circuit for MOSFET switching applications and presents examples of gate driver circuits 8/2017

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Describes current imbalance in parallel MOSFETs and the mechanism of parasitic oscillation 8/2017

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Describes the oscillation mechanism of MOSFETs for switching applications 8/2017

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Catalog

Catalog
Name outline Date of issue
Describes the lineups of MOSFET 9/2017
Describes the lineups of Small Package(MOSFET/BJT/Diode/Linear IC/Logic/RF Device) 9/2017
Describes the lineups of power and small-signal MOSFETs by package 3/2016

Video


Products

VDSS
(V)
RDS(ON)
(mΩ)
TSON Advance SOP Advance DSOP Advance TO-220 TO-220SIS DPAK D2PAK
30 10 - 20 TPN11003NL TPH11003NL
5 - 10 TPN8R903NL
TPN6R003NL
TPH8R903NL
TPH6R003NL
3 - 5 TPN5R203PL
TPN4R303NL
TPH4R803PL
TPH4R003NL
TPH3R203NL
1 - 3 TPN2R903PL
TPN2R703NL
TPN1R603PL
TPH3R003PL
TPH2R903PL
TPH2R003PL

TPH1R403NL
< 1 TPHR9203PL
TPHR9003NL
TPHR6503PL
TPWR8503NL
TPWR6003PL
40 10 - 20
5 - 10 TPN7R504PL TPH7R204PL
TPH6R004PL
3 - 5 TPN3R704PL TPH3R704PC
TPH3R704PL
TK3R1E04PL TK3R1A04PL TK3R1P04PL
1 - 3 TPN2R304PL TPH2R104PL
TPH1R204PB
TPH1R204PL
< 1 TPHR8504PL TPWR8004PL
45 1 - 3 TPN2R805PL TPH2R805PL
TPH1R405PL
TPH1R005PL
< 1 TPW1R005PL
60 20 - 50 TPN22006NH
10 - 20 TPN14006NH
TPN11006NL
TPN11006PL
TPH14006NH
TPH11006NL
TK30E06N1
TK40E06N1
TK30A06N1
TK40A06N1
5 - 10 TPN7R506NH
TPN7R006PL
TPH9R506PL
TPH7R506NH
TPH7R006PL
TPH5R906NH
TK8R2E06PL
TK58E06N1
TK5R1E06PL
TK8R2A06PL
TK58A06N1
TK5R3A06PL
TK6R7P06PL
3 - 5 TPN4R806PL TPH4R606NH
TPH3R506PL
TK4R3E06PL
TK3R2E06PL
TK4R3A06PL
TK3R3A06PL
TK4R4P06PL
1 - 3 TPH2R306NH
TPH2R506PL
TPH1R306PL
TPW1R306PL TK100E06N1 TK100A06N1
75 1 - 3 TPH2R608NH TPW2R508NH
80 30 - 50 TPN30008NH
10 - 20 TPN13008NH TPH12008NH TK35E08N1 TK35A08N1
5 - 10 TPH8R008NH TK46E08N1 TK46A08N1
3 - 5 TPH4R008NH TPW4R008NH TK72E08N1
TK100E08N1
TK72A08N1
TK100A08N1
100 30 - 50 TPN3300ANH
10 - 20 TPN1600ANH
TPN1200APL
TPH1400ANH TK22E10N1 TK22A10N1
5 - 10 TPH8R80ANH
TPH6R30ANL
TK34E10N1
TK40E10N1
TK34A10N1
TK40A10N1
3 - 5 TPH4R50ANH
TPH4R10ANL
TPH3R70APL
TPW4R50ANH TK65E10N1
TK100E10N1
TK65A10N1
TK100A10N1
TK65G10N1
120 10 - 20 TK32E12N1 TK32A12N1
5 - 10 TK42E12N1
TK56E12N1
TK42A12N1
TK56A12N1
3 - 5 TK72E12N1 TK72A12N1
150 50 - 100 TPN5900CNH TPH5900CNH
20 - 50 TPH3300CNH
10 - 20 TPH1500CNH TPW1500CNH
200 100 - 200 TPN1110ENH TPH1110ENH
50 - 100 TPH6400ENH
20 - 50 TPH2900ENH TPW2900ENH
250 200 - 300 TPN2010FNH TPH2010FNH
100 - 200 TPH1110FNH
50 - 100 TPH5200FNH TPW5200FNH
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MOSFET Product Lineup
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.