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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Silicon carbide MOSFETs are used in high-voltage power designs that require efficient switching, low power loss and reliable operation under demanding thermal conditions. Selecting the correct device requires more than comparing voltage and current ratings. Engineers must also evaluate on-resistance, gate charge, switching behavior, package type and thermal performance.
The drain-source voltage rating must provide sufficient margin above the system’s normal operating voltage. Switching transients, line variation and parasitic inductance can produce voltage overshoot that exceeds the nominal bus voltage. Engineers should review the maximum operating conditions and validate the device under expected fault and transient conditions.
Low drain-source on-resistance helps reduce conduction loss when the MOSFET is on. Gate charge, capacitance and switching speed affect energy loss during turn-on and turn-off. The correct balance depends on switching frequency, load current, cooling capability and efficiency targets.
SiC MOSFETs require a gate-drive circuit that supports the recommended gate voltage and switching behavior. Gate resistance can be adjusted to manage switching speed, ringing, EMI and voltage overshoot. PCB layout should keep the gate-drive loop short and minimize parasitic inductance.
Package selection affects heat dissipation, isolation, board space and switching performance. Engineers should calculate power loss and junction temperature using the expected operating current, switching frequency, ambient temperature and cooling method.
Toshiba SiC MOSFETs are designed for high-voltage and high-efficiency applications, including industrial power supplies, solar inverters and uninterruptible power supplies. Review the available voltage ratings, packages and electrical characteristics on the Toshiba SiC MOSFET product page.