Products
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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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For photocouplers, the structure inside the package also varies depending on the condition such as the required isolation performance, package size, and internal chip size.
1. Face-to-face type in single mold
The LED-mounted frame and the photodetector-mounted frame face each other (transmissive) and are molded. Silicone resin is used for the optical transmission part between the LED and the photodetector.
2. Face-to-face type in single mold (with a polyimide film)
To increase an isolation voltage between an input and an output, a polyimide film is inserted between the LED and the photodetector.
3. Face-to-face type in double mold
This photocoupler adopts a face-to-face type structure, and is white-molded inside and black-molded outside. Resin with high infrared light transmittance is used for the white mold of the optical transmission part.
4. Reflective type
This photocoupler adopts a structure that has the LED-mounted frame and the photodetector-mounted frame on the same plane. It is called "reflective type" because LED light reflected inside silicone resin reaches the photodetector.
①Body
②Window
③Detector
④LED
⑤Film