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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Thermal shutdown function and recovery operation

Thermal Shutdown function and recovery operation

If an overcurrent or overvoltage condition persists for a long time in the eFuse IC and the IC temperature exceeds the set temperature, the IC is placed in a standby state to shut off the output and prevent the output from being damaged by the thermal shutdown function. Toshiba eFuse IC turns off the power by turning off the built-in MOSFET by thermal shutdown function from overcurrent. The auto-try (Auto retry) function, which automatically recovers when the temperature drops, and the latch-type (Latch) function, which releases recovers the temperature  when the the temperature drops control signal is input again, are available.

When the internal thermal shutdown function works and output is turned off during short-circuit protection operation under overcurrent clamp or overvoltage clamp, there are two ways to release the output. The auto-retry-type product automatically recovers without external signals when the temperature inside the eFuse IC drops. The latch-type product is recovered by re-entering the control enable terminal. Select the optimum type depending on the part to be used.

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