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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Is there a way to dissipate heat from high-voltage IPDs?
By attaching a heat sink, it is possible to improve the heat dissipation performance. If a heat sink is required due to ambient temperature, heat generation of peripheral components, and heat generation of the device itself, please refer to the application note for each product and consider attaching a heat sink.
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The following documents also contain related information.
