Is there a way to dissipate heat from high-voltage IPDs?

By attaching a heat sink, it is possible to improve the heat dissipation performance. If a heat sink is required due to ambient temperature, heat generation of peripheral components, and heat generation of the device itself, please refer to the application note for each product and consider attaching a heat sink.

Fig. 1 The example of heatsink attachment
Fig. 1 The example of heatsink attachment
The heat sink attachment method for high-voltage IPDs is also described in the application note. Please also refer to these documents.

Related Links

The following documents also contain related information.


Application Notes

Product Lists

A new window will open