Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched "TLP3450S" a low voltage photorelay for semiconductor testers.
Semiconductor testers (ATE: Automated Test Equipment) verify that DUT is operating correctly by applying a voltage/current to the specified pins of the device under test (DUT), such as the system LSI or semiconductor memory. A number of photorelays (MOSFET output), a type of solid state relay, are used to switch the route of the specified pins.
ATE is required to be throughput-efficient in order to measure a lot of DUT with a large number of pins at once. Thus, high-speed switching is required to reduce the loss of test time due to switching. Also to meet this demand, photorelays are required to be miniaturized in order to mount a large number on a limited board space.
In addition, because of its small size and high temperature operation, it is a semiconductor switch that can be used in a wide range of applications, including PLC (Programmable Logic Controller) and other industrial equipment, in addition to ATE applications.
The new TLP3450S uses a small S-VSON4T package. We have also improved the optical output of infrared LEDs and optimizing the design of photo detector devices (photodiode arrays). As a result, the switching time (turn-on time) of the new product is 80μs (max), which is 40% of the existing product TLP3450. In addition, TLP3450S has a smaller output capacitance that affects high-frequency signal leakage when the output is turned off, and a lower on-resistance that affects signal attenuation when the output is turned on. TLP3450S is suitable for the pin electronics of semiconductor testers, which measure DUT with high accuracy and at high speeds.
In ATE, many DUT with many terminals must be measured in limited time. If the switching time of the photorelay itself is slow, DUT testing time will be longer. This product has a turn-on time of 80μs (max), which is 40% of our existing product TLP3450. This contributes to the overall throughput of the system.
Capacitance between the MOSFET’s output pins in the off state is called output capacitance and is expressed as COFF. When a signal other than direct current such as pulse is controlled, the signal leaks through this capacitance when the photorelay is off state. Especially in ATE, highly accurate DUT measurement is required, but it is not preferable if COFF is large, because the leakage current easily flows. Although COFF of our existing product TLP3450 is 0.8pF (typ.), this product achieves 0.6pF (typ.) Signal leakage in off state can be further suppressed.
The test head has two major categories: the device power supply (DPS) and the pin electronics (PE). ATE uses relays to switch power supply and signal to measure a number of DUTs at once. While technological innovations such as high-speed processing of testers are unusual, high density test boards are inevitable for semiconductor testers that must cope with low cost and high reliability. Existing mechanical relays cannot meet these requirements, and semiconductor relays (photorelays) replace them, so many photorelays are mounted in a limited board space. The new TLP3450S uses a small package S-VSON4T (1.45mm×2.0mm (typ.), t=1.4mm (max)) that can contribute to improved mounting density. The footprint is approximately 18% smaller than that of our existing product TLP3450.
* It is also suitable for applications such as PLC (Programmable Logic Controller) which have a number of interfaces on a small frame.
(Ta=25°C)
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