Thermal shutdown

Thermal Shutdown function

The thermal shutdown function is a circuit that prevents deterioration and breakdown due to a significant increase in ambient temperature and heat generation of the device itself due to an unintended large current load. When the specified temperature is detected by the internal temperature-detecting circuit, the overheat-protecting circuit operates to control the ON/OFF of the output transistor. In the TCK11xG series, the detected temperature is designed to exceed 150℃ at the absolute maximum-rated temperature (Tj) of the chip junction.

The thermal shutdown function of our load switch ICs is to turn off the MOSFET inside the load switch when the temperature exceeds the thermal shutdown operation detection temperature specified for each product, thereby reducing the output voltage VOUT and limiting the output current IOUT. This function protects the device from damage during overheating.

Load switch IC built-in thermal shutdown function

Products list (parametric search)

Related information

Back to Load Switch ICs

Contacts

Technical inquiry

Contact us

Contact us

Frequently Asked Questions

FAQs

Queries about purchasing, sampling and IC reliability

Stock Check & Purchase

require 3 characters or more.

keyword:

Click this link to check inventory of TOSHIBA parts available at those distributors of Toshiba America Electronic Components, Inc. ("TAEC") who participate in netCOMPONENTS electronic components sourcing database. Please note that TAEC is providing this link solely as a convenience. All quantities listed in inventory are subject to change and information provided in this page does not guarantee availability of product(s), please check with Distributor before relying on the quantities listed. In order to guarantee availability you must place an order with one of Toshiba’s distributors.
A new window will open