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Thermal shutdown
The thermal shutdown function is a circuit that prevents deterioration and breakdown due to a significant increase in ambient temperature and heat generation of the device itself due to an unintended large current load. When the specified temperature is detected by the internal temperature-detecting circuit, the overheat-protecting circuit operates to control the ON/OFF of the output transistor. In the TCK11xG series, the detected temperature is designed to exceed 150℃ at the absolute maximum-rated temperature (Tj) of the chip junction.
The thermal shutdown function of our load switch ICs is to turn off the MOSFET inside the load switch when the temperature exceeds the thermal shutdown operation detection temperature specified for each product, thereby reducing the output voltage VOUT and limiting the output current IOUT. This function protects the device from damage during overheating.
Load switch IC built-in thermal shutdown function
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Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.
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