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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Thermal Shutdown function

The thermal shutdown function is a circuit that prevents deterioration and breakdown due to a significant increase in ambient temperature and heat generation of the device itself due to an unintended large current load. When the specified temperature is detected by the internal temperature-detecting circuit, the overheat-protecting circuit operates to control the ON/OFF of the output transistor. In the TCK11xG series, the detected temperature is designed to exceed 150℃ at the absolute maximum-rated temperature (Tj) of the chip junction.

The thermal shutdown function of our load switch ICs is to turn off the MOSFET inside the load switch when the temperature exceeds the thermal shutdown operation detection temperature specified for each product, thereby reducing the output voltage VOUT and limiting the output current IOUT. This function protects the device from damage during overheating.

Load switch IC built-in thermal shutdown function

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