Uninterruptible power supply

Uninterruptible power supply

Such as low power consumption and miniaturization are important in designing uninterruptible power supply (UPS). Toshiba provides information on a wide range of semiconductor products suitable for power sullpy units, inverter/converter units, control units, signal transmission units, etc., along with circuit configuration examples.

Overall block diagram

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 Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver ISO AMP ISOAMP ISO AMP ISOAMP IB-LS IB-LS IB-HS IB-HS VB-SENSE VB-SENSE Gate Driver GateDriver ISO AMP ISOAMP Main MCU Main MCU Isolation Isolation Communication MCU CommunicationMCU Display Display USB USB CAN CAN RS-232C RS-232C RS-422/485 RS-422/485 30 to 60 V 30 to 60 V 300 to 400 V 300 to 400 V Gate Driver GateDriver Gate Driver GateDriver MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET MOSFET Voltage and current detection signal transmission line Control signal transmission line Power supply to main MCU DC-DC converter and control circuit Communication signal transmission line Power supply to communication MCU Display unit USB interface RS-232 interface
USB interface

Example of ESD protection circuit for USB signal line

RS-232 interface

Example of ESD protection circuit for RS-232C signal line

Display unit

Example of ESD protection circuit for a display signal line

Control signal transmission line between MCU and converter

Example of control signal transmission circuit between MCU and converter

Communication signal transmission line between MCUs

Example of communication signal transmission circuit between MCUs

Voltage and current detection signal transmission line

Example of voltage and current detection signal transmission circuit between power line and MCU

DC-DC converter and control circuit

Example of DC-DC converter and control circuit

Power supply to analog front end

Example of power supply circuit to analog front end

Power supply to main MCU

Example of power supply circuit to main MCU

Power supply to communication MCU

Example of power supply circuit to communication MCU

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 PFC Controller PFCController Main MCU MainMCU AC Input AC Input DC Output 300 to 400 V DC Output300 to 400 V MOSFET MOSFET AC-DC converter (with PFC circuit) and control circuit Power supply to main MCU
AC-DC converter (with PFC circuit) and control circuit

Example of AC-DC converter (with PFC circuit) and control circuit

Power supply to main MCU

Example of power supply circuit to main MCU

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 Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver Gate Driver GateDriver Main MCU MainMCU AC Output AC Output C C DC Input 300 to 400 V DC Input300 to 400 V MOS FET MOSFET MOS FET MOSFET MOS FET MOSFET MOS FET MOSFET Power supply to main MCU DC-AC inverter and control circuit
DC-AC inverter and control circuit

Example of DC-AC inverter and control circuit

Power supply to main MCU

Example of power supply circuit to main MCU

Sub block diagram

USB interface
USB interface

Example of ESD protection circuit for USB signal line

Example of ESD protection circuit for USB signal line
Absorbs static electricity (ESD) from external terminals, prevents circuit malfunction and protects devices.
Part Number
Toshiba Package Name SOD-962 (SL2) SOD-962 (SL2) SOD-962 (SL2)
VESD (Max) [kV] +/-30 +/-20 +/-20
IR (Max) [µA] 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.5 0.5
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 0.2 0.2
RS-232 interface
RS-232 interface

Example of ESD protection circuit for RS-232C signal line

Example of ESD protection circuit for RS-232C signal line
Absorbs static electricity (ESD) from external terminals, prevents circuit malfunction and protects devices.
Part Number
Toshiba Package Name SOD-962 (SL2) SOD-962 (SL2) SOD-962 (SL2)
VESD (Max) [kV] +/-30 +/-20 +/-20
IR (Max) [µA] 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.5 0.5
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 0.2 0.2
Display unit
Display unit

Example of ESD protection circuit for a display signal line

Example of ESD protection circuit for a display signal line
Absorbs static electricity (ESD) from external terminals, prevents circuit malfunction and protects devices.
Part Number
Toshiba Package Name SOD-962 (SL2) SOD-962 (SL2) SOD-962 (SL2)
VESD (Max) [kV] +/-30 +/-20 +/-20
IR (Max) [µA] 0.1 0.1 0.1
Rdyn (Typ.) [Ω] 0.2 0.5 0.5
CT (Typ.) [pF] @ VR = 0 [V], f = 1 [MHz] 8.5 0.2 0.2
Control signal transmission line between MCU and converter
Control signal transmission line between MCU and converter

Example of control signal transmission circuit between MCU and converter

Example of control signal transmission circuit between MCU and converter
High isolation by optical coupling solution and characteristics suitable for gate driving help to simplify circuit design.
Part Number
Toshiba Package Name SO16L SO16L SO16L SO16L SO6L SO6L
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000 5000 5000 5000 5000
VCC / VDD (Min) [V] 15 15 15 15.0 15 15
VCC / VDD (Max) [V] 30 30 30 23.5 30 30
ICC / IDD (Max) [mA] 3.8 5 5 10.2 3 3
Output Interface totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF)  
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Communication signal transmission line between MCUs
Communication signal transmission line between MCUs

Example of communication signal transmission circuit between MCUs

Example of communication signal transmission circuit between MCUs
High isolation performance using the optical coupling enables stable and high speed isolated communication.
Part Number
Toshiba Package Name SO6L SO6L SO6L SO8L(LF4) SO8L(LF4) SO8L(LF4)
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000 5000 5000 5000 5000
VCC / VDD (Min) [V] 2.7 2.7 2.7 2.7 2.7 2.7
VCC / VDD (Max) [V] 5.5 5.5 5.5 5.5 5.5 5.5
ICC / IDD (Max) [mA] 0.3 1 0.4 0.6 2 0.8
Output Interface totem-pole(BUF) totem-pole(INV) totem-pole(BUF) totem-pole(BUF) totem-pole(INV) totem-pole(BUF)
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Voltage and current detection signal transmission line
Voltage and current detection signal transmission line

Example of voltage and current detection signal transmission circuit between power line and MCU

Example of voltage and current detection signal transmission circuit between power line and MCU
High isolation performance by the optical coupling is realized. High precision current and voltage detection are also realized.
Part Number
Toshiba Package Name SO8L(LF4) SO8L(LF4)
Output Interface Analog output Digital output
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000
VDD1 (Max) [V] 5.5 5.5
VDD2 (Max) [V] 5.5 5.5
IDD1 (Max) [mA] @ VIN+ = 0 [V] 12 12
IDD2 (Max) [mA] @ VIN+ = 0 [V] 10 8
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
DC-DC converter and control circuit
DC-DC converter and control circuit

Example of DC-DC converter and control circuit

Example of DC-DC converter and control circuit
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TO-220SIS TO-220SIS TO-220SIS TO-220SIS
VDSS (Max) [V] 600 600 650 650
ID (Max) [A] 25 15.8 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.125 0.23 0.11 0.19
Polarity N-ch N-ch N-ch N-ch
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TOLL TOLL
VDSS (Max) [V] 650 650
ID (Max) [A] 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.11 0.19
Polarity N-ch N-ch
The performance index RDS(ON) x Qgd, which shows switching characteristics, is reduced. This contributes to lower loss of power supply in equipment.
Part Number
Toshiba Package Name TO-247 TO-247 TO-247-4L(X) TO-247-4L(X)
VDSS (Max) [V] 650 1200 650 1200
ID (Max) [A] 100 100 100 100
RDS(ON) (Max) [Ω] @ |VGS| = 18.0 [V] 0.021 0.02 0.022 0.021
Polarity N-ch N-ch N-ch N-ch
Contribution to energy saving and efficiency increasing with wide variety of lineup and easy design.
Part Number
Toshiba Package Name TSON Advance SOP Advance(N) SOP Advance(E) SOP Advance(E)
VDSS (Max) [V] 80 80 80 150
ID (Max) [A] 34 86 238 120
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.019 0.004 0.0019 0.0071
Polarity N-ch N-ch N-ch N-ch
Contribution to energy saving and efficiency increasing with wide variety of lineup and easy design.
Part Number
Toshiba Package Name TO-220SIS TO-220 TO-220
VDSS (Max) [V] 80 80 100
ID (Max) [A] 100 120 207
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.00244 0.00244 0.0034
Polarity N-ch N-ch N-ch
High isolation by optical coupling solution and characteristics suitable for gate driving help to simplify circuit design.
Part Number
Toshiba Package Name SO16L SO16L SO16L SO16L SO6L SO6L
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000 5000 5000 5000 5000
VCC / VDD (Min) [V] 15 15 15 15.0 15 15
VCC / VDD (Max) [V] 30 30 30 23.5 30 30
ICC / IDD (Max) [mA] 3.8 5 5 10.2 3 3
Output Interface totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF)  
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Power supply to analog front end
Power supply to analog front end

Example of power supply circuit to analog front end

Example of power supply circuit to analog front end
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name WCSP6F DFN5B DFN4D WCSP4F DFN4F
IOUT (Max) [mA] 1500 800 500 500 300
VOUT [V] 0.6 to 3.6 0.8 to 3.6 0.9 to 5.0 0.9 to 5.0 0.9 to 4.5
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name SOT-25 (SMV) DFN4D DFN4D DFN4D SOT-25 (SMV)
IOUT (Max) [mA] 300 300 300 300 150
VOUT [V] 0.8 to 5.0 0.8 to 5.0 1.0 to 4.5 0.8 to 5.0 1.8 to 5.0
Power supply to main MCU
Power supply to main MCU

Example of power supply circuit to main MCU

Example of power supply circuit to main MCU
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name WCSP6F DFN5B DFN4D WCSP4F DFN4F
IOUT (Max) [mA] 1500 800 500 500 300
VOUT [V] 0.6 to 3.6 0.8 to 3.6 0.9 to 5.0 0.9 to 5.0 0.9 to 4.5
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name SOT-25 (SMV) DFN4D DFN4D DFN4D SOT-25 (SMV)
IOUT (Max) [mA] 300 300 300 300 150
VOUT [V] 0.8 to 5.0 0.8 to 5.0 1.0 to 4.5 0.8 to 5.0 1.8 to 5.0
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Power supply to communication MCU
Power supply to communication MCU

Example of power supply circuit to communication MCU

Example of power supply circuit to communication MCU
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name WCSP6F DFN5B DFN4D WCSP4F DFN4F
IOUT (Max) [mA] 1500 800 500 500 300
VOUT [V] 0.6 to 3.6 0.8 to 3.6 0.9 to 5.0 0.9 to 5.0 0.9 to 4.5
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name SOT-25 (SMV) DFN4D DFN4D DFN4D SOT-25 (SMV)
IOUT (Max) [mA] 300 300 300 300 150
VOUT [V] 0.8 to 5.0 0.8 to 5.0 1.0 to 4.5 0.8 to 5.0 1.8 to 5.0
AC-DC converter (with PFC circuit) and control circuit
AC-DC converter (with PFC circuit) and control circuit

Example of AC-DC converter (with PFC circuit) and control circuit

Example of AC-DC converter (with PFC circuit) and control circuit
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TO-220SIS TO-220SIS TO-220SIS TO-220SIS
VDSS (Max) [V] 600 600 650 650
ID (Max) [A] 25 15.8 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.125 0.23 0.11 0.19
Polarity N-ch N-ch N-ch N-ch
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TOLL TOLL
VDSS (Max) [V] 650 650
ID (Max) [A] 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.11 0.19
Polarity N-ch N-ch
The performance index RDS(ON) x Qgd, which shows switching characteristics, is reduced. This contributes to lower loss of power supply in equipment.
Part Number
Toshiba Package Name TO-247 TO-247 TO-247-4L(X) TO-247-4L(X)
VDSS (Max) [V] 650 1200 650 1200
ID (Max) [A] 100 100 100 100
RDS(ON) (Max) [Ω] @ |VGS| = 18.0 [V] 0.021 0.02 0.022 0.021
Polarity N-ch N-ch N-ch N-ch
SiC Schottky barrier diodes with low loss and high efficiency are realized by adopting new metal and optimizing device design.
Part Number
Toshiba Package Name TO-247 TO-220-2L TO-220-2L TO-220-2L DFN 8×8 DFN 8×8
IF(DC) (Max) [A] 24 2 8 12 4 12
VRRM (Max) [V] 650 650 650 650 650 650
VF (Max) [V] 1.6 1.35 1.35 1.35 1.35 1.35
IR (Max) [µA] @ VRRM (Max) 60 40 90 120 55 120
High isolation by optical coupling solution and characteristics suitable for gate driving help to simplify circuit design.
Part Number
Toshiba Package Name SO16L SO16L SO16L SO16L SO6L SO6L
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000 5000 5000 5000 5000
VCC / VDD (Min) [V] 15 15 15 15.0 15 15
VCC / VDD (Max) [V] 30 30 30 23.5 30 30
ICC / IDD (Max) [mA] 3.8 5 5 10.2 3 3
Output Interface totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF)  
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Power supply to main MCU
Power supply to main MCU

Example of power supply circuit to main MCU

Example of power supply circuit to main MCU
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name WCSP6F DFN5B DFN4D WCSP4F DFN4F
IOUT (Max) [mA] 1500 800 500 500 300
VOUT [V] 0.6 to 3.6 0.8 to 3.6 0.9 to 5.0 0.9 to 5.0 0.9 to 4.5
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name SOT-25 (SMV) DFN4D DFN4D DFN4D SOT-25 (SMV)
IOUT (Max) [mA] 300 300 300 300 150
VOUT [V] 0.8 to 5.0 0.8 to 5.0 1.0 to 4.5 0.8 to 5.0 1.8 to 5.0
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
DC-AC inverter and control circuit
DC-AC inverter and control circuit

Example of DC-AC inverter and control circuit

Example of DC-AC inverter and control circuit
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TO-220SIS TO-220SIS TO-220SIS TO-220SIS
VDSS (Max) [V] 600 600 650 650
ID (Max) [A] 25 15.8 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.125 0.23 0.11 0.19
Polarity N-ch N-ch N-ch N-ch
Improved performance index RDS(ON) x Qgd, which shows switching characteristic, contribute to improve power supply efficiency and miniaturization of the set.
Part Number
Toshiba Package Name TOLL TOLL
VDSS (Max) [V] 650 650
ID (Max) [A] 24 15
RDS(ON) (Max) [Ω] @ |VGS| = 10.0 [V] 0.11 0.19
Polarity N-ch N-ch
The performance index RDS(ON) x Qgd, which shows switching characteristics, is reduced. This contributes to lower loss of power supply in equipment.
Part Number
Toshiba Package Name TO-247 TO-247 TO-247-4L(X) TO-247-4L(X)
VDSS (Max) [V] 650 1200 650 1200
ID (Max) [A] 100 100 100 100
RDS(ON) (Max) [Ω] @ |VGS| = 18.0 [V] 0.021 0.02 0.022 0.021
Polarity N-ch N-ch N-ch N-ch
High isolation by optical coupling solution and characteristics suitable for gate driving help to simplify circuit design.
Part Number
Toshiba Package Name SO16L SO16L SO16L SO16L SO6L SO6L
BVS (Min) [Vrms] @ t = 60 [s] 5000 5000 5000 5000 5000 5000
VCC / VDD (Min) [V] 15 15 15 15.0 15 15
VCC / VDD (Max) [V] 30 30 30 23.5 30 30
ICC / IDD (Max) [mA] 3.8 5 5 10.2 3 3
Output Interface totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF) totem-pole(BUF)  
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.
Power supply to main MCU
Power supply to main MCU

Example of power supply circuit to main MCU

Example of power supply circuit to main MCU
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name WCSP6F DFN5B DFN4D WCSP4F DFN4F
IOUT (Max) [mA] 1500 800 500 500 300
VOUT [V] 0.6 to 3.6 0.8 to 3.6 0.9 to 5.0 0.9 to 5.0 0.9 to 4.5
Wide lineup from general purpose type to WCSP (Wafer Level Chip Size Package) type are provided. Contribute to realize a stable power supply.
Part Number
Toshiba Package Name SOT-25 (SMV) DFN4D DFN4D DFN4D SOT-25 (SMV)
IOUT (Max) [mA] 300 300 300 300 150
VOUT [V] 0.8 to 5.0 0.8 to 5.0 1.0 to 4.5 0.8 to 5.0 1.8 to 5.0
Monitoring sensor at low power consumption by using built-in AD converters, timers and various communication interfaces.

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Switched Mode Power Supply Library

you can select and download various basic topologies of a power supply unit based on your actual requirements in order to verify the behavior of MOSFETs with your simulation environment.

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you can select and download various basic topologies of motor driver such as three-phase inverter circuit based on your actual requirements in order to verify the behavior of MOSFETs and another devices for your simulation environment.

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EDA/CAD Model Library

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MCU Motor Studio

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