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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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Package Trends of Automotive MOSFETs
Package technology trends
Power MOSFET Packaging Technology Trend
DPAK＋, DSOP Advance(WF), SOP Advance(WF), and TSON Advance(WF) feature a Cu connector structure to achieve a current-carrying capacity, approximately twice that of conventional models. In addition, the newly developed S-TOGL™ and L-TOGL™ adopt the Cu clip structure (postless structure) and Multi-pin structure, which is an evolution of the Cu connector structure, to achieve further improvement in high current performance.
We are expanding our product lineup to meet the various needs of automotive applications.
Small Packages Technology Trend
The small MOSFET offers a wide choice of breakdown voltages and drive voltages ranging from small-signal to middle-class semi-power types. There is a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area.
Automotive MOSFETs
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- Package (MOSFETs)
- News Release：Toshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package that Supports Larger Currents for Auomotive EquipmentToshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package that Supports Larger Currents for Auomotive Equipment
- News Release：Toshiba is a Winner at AspenCore World Electronics Achievement Awards
- Newly designed, non-recommended, scheduled end-of-production products
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Click this link to check inventory of TOSHIBA parts available at those distributors of Toshiba America Electronic Components, Inc. ("TAEC") who participate in netCOMPONENTS electronic components sourcing database. Please note that TAEC is providing this link solely as a convenience. All quantities listed in inventory are subject to change and information provided in this page does not guarantee availability of product(s), please check with Distributor before relying on the quantities listed. In order to guarantee availability you must place an order with one of Toshiba’s distributors.
* S-TOGL™、L-TOGL™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.
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