Package Trends of Automotive MOSFETs

Package technology trends

Power MOSFET Packaging Technology Trend

Pacage Size/Mounting Area (㎟)

DPAK+, DSOP Advance(WF), SOP Advance(WF), and TSON Advance(WF) feature a Cu connector structure to achieve a current-carrying capacity, approximately twice that of conventional models. In addition, the newly developed S-TOGL™ and L-TOGL™ adopt the Cu clip structure (postless structure) and Multi-pin structure, which is an evolution of the Cu connector structure, to achieve further improvement in high current performance.
We are expanding our product lineup to meet the various needs of automotive applications. 

Small Packages Technology Trend

Small Packages Packaging Technologies Trend

The small MOSFET offers a wide choice of breakdown voltages and drive voltages ranging from small-signal to middle-class semi-power types. There is a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area.

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Click this link to check inventory of TOSHIBA parts available at those distributors of Toshiba America Electronic Components, Inc. ("TAEC") who participate in netCOMPONENTS electronic components sourcing database. Please note that TAEC is providing this link solely as a convenience. All quantities listed in inventory are subject to change and information provided in this page does not guarantee availability of product(s), please check with Distributor before relying on the quantities listed. In order to guarantee availability you must place an order with one of Toshiba’s distributors.

* S-TOGL™、L-TOGL™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.

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