Package Trends of Automotive MOSFETs
Package technology trends
Power MOSFET Packaging Technology Trend
DPAK+, DSOP Advance (WF), SOP Advance (WF), and TSON Advance (WF) adopt Cu connector structures, realizing high current conduction capability. Furthermore, the new packaging types, S-TOGL™ and L-TOGL™, achieve even higher current conduction capability by evolving the Cu connector structure into a Cu clip structure (internal postless structure) and adopting multi-pin structures. Additionally, the SOF-Dual currently under development reduces the mounting area by approximately 40% compared to using two SOP Advance (WF) units. This contributes to the miniaturization of sets. We are expanding our product lineup to meet various needs of automotive applications.
Small Packages Technology Trend
The small MOSFET offers a wide choice of breakdown voltages and drive voltages ranging from small-signal to middle-class semi-power types. There is a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area.
Automotive MOSFETs
Related information
- Simulation model
- Product numbering method
- Package (L-TOGL™)
- Package (S-TOGL™)
- Package (MOSFETs)
- Toshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package that Supports Larger Currents for Automotive Equipment
- Newly designed, non-recommended, scheduled end-of-production products
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* S-TOGL™、L-TOGL™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
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