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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Package Trends of Automotive MOSFETs
Package technology trends
Power MOSFET Packaging Technology Trend
DPAK+, DSOP Advance (WF), SOP Advance (WF), and TSON Advance (WF) adopt Cu connector structures, realizing high current conduction capability. Furthermore, the new packaging types, S-TOGL™ and L-TOGL™, achieve even higher current conduction capability by evolving the Cu connector structure into a Cu clip structure (internal postless structure) and adopting multi-pin structures. Additionally, the SOF-Dual currently under development reduces the mounting area by approximately 40% compared to using two SOP Advance (WF) units. This contributes to the miniaturization of sets. We are expanding our product lineup to meet various needs of automotive applications.
Small Packages Technology Trend
The small MOSFET offers a wide choice of breakdown voltages and drive voltages ranging from small-signal to middle-class semi-power types. There is a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area.
Automotive MOSFETs
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