Package Trends of Automotive MOSFETs

Package technology trends

Power MOSFET Packaging Technology Trend

Pacage Size/Mounting Area (㎟)

DPAK+, DSOP Advance(WF), SOP Advance(WF), and TSON Advance(WF) feature a Cu connector structure to achieve a current-carrying capacity, approximately twice that of conventional models. In addition, the newly developed S-TOGL™ and L-TOGL™ adopt the Cu clip structure (postless structure) and Multi-pin structure, which is an evolution of the Cu connector structure, to achieve further improvement in high current performance.
We are expanding our product lineup to meet the various needs of automotive applications. 

Small Packages Technology Trend

Small Packages Packaging Technologies Trend

The small MOSFET offers a wide choice of breakdown voltages and drive voltages ranging from small-signal to middle-class semi-power types. There is a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area.

Related information

Contacts

Technical inquiry

Contact us

Contact us

Frequently Asked Questions

FAQs

Queries about purchasing, sampling and IC reliability

Stock Check & Purchase

keyword:

Disclaimer for External Link
Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.

* S-TOGL™、L-TOGL™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company names, product names, and service names may be trademarks of their respective companies.

A new window will open