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In a board design, what are the methods for reducing the junction temperature?

There are the following methods for reducing heat.
-Use heat sink,
-Choose a package with superior heat dissipation
-Add thermal via holes
-Increase pattern area
-Increase pattern thickness

For reducing the junction temperature, please refer to “Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes (PDF:1,061KB)

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