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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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In a board design, what are the methods for reducing the junction temperature?

There are the following methods for reducing heat.
-Use heat sink,
-Choose a package with superior heat dissipation
-Add thermal via holes
-Increase pattern area
-Increase pattern thickness

For reducing the junction temperature, please refer to “Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes”

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