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Are there any special considerations for heat dissipation from power transistors?

  1. When a power device is screwed onto a board, do not tighten the device excessively. Care should be exercised especially when tightening a device with tap screws. Depending on the tilting of screws and an electric power screwdriver, tremendous stress could damage the mold resin of the device during the last few revolutions of the tightening process. To avoid this problem, use a screwdriver with torque control.
  2. Additionally, consider heat removal performance necessary under the worst-case operating conditions so as to select a heat sink with adequate thermal resistance.
    Consider forced cooling using a fan or the like as necessary.
  3. Use screws of a size that matches the hole diameter.
  4. For information about silicone and other insulating heat dissipation sheets, contact resin manufacturers.
    Apply silicone thermal grease to further improve heat dissipation (i.e., reduce thermal resistance).
  5. The mounting plane of a heat sink should be as flat as possible. An uneven surface could subject a device to excessive stress and damage it permanently in the worst-case scenario. The most commonly used heat sinks are made of aluminum or copper, both of which have excellent heat conduction properties.
  6. Do not apply any mechanical stress to a heat sink once it is attached to a device.

Except for isolating power devices, a heat sink will have the same electrical potential as the collector or drain terminal. Therefore, isolation treatment may be necessary for the heat sink.


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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.