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What are the important considerations when using a heat sink?

If the heat sink has burrs or hollows, if its attachment profile is the wrong size, or if the tightening torque of the MOSFET is inadequate, the MOSFET will be warped, causing destruction of the chip or resin.
Exercise care concerning flatness of the heat sink, how to attach it, etc.

For how to attach a heat sink, please refer to “Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes (PDF:1,061KB)

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.