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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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What are the important considerations when using a heat sink?
If the heat sink has burrs or hollows, if its attachment profile is the wrong size, or if the tightening torque of the MOSFET is inadequate, the MOSFET will be warped, causing destruction of the chip or resin.
Exercise care concerning flatness of the heat sink, how to attach it, etc.
For how to attach a heat sink, please refer to “Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes”