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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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How to calculate for selecting a heat sink of a semiconductor device (1)

With the heat sink attached, calculate the permissible junction temperature of the semiconductor device by using junction-to-ambient thermal resistance (Rth(j-cf) + Rth(cf-a)).
( Tj - Ta ) = ( Rth(j-cf) + Rth(cf-a) ) × P

Select heat sink of thermal resistance so that the junction temperature of the semiconductor device is within the allowable range of value.
Rth(cf-a) = ((Tj - Ta) / P) - Rth(j-cf)

For example, Tj = 120 [deg.C], Ta = 50 [deg.C], P = 10 [W], Rth(j-cf) = 0.5 [deg.C/W] (When the contact resistance between a semiconductor device and a heat sink is disregarded)
Rth(cf-a) = 6.5 [deg.C/W]
To use a heat sink of a thermal resistance value lower than 6.5 deg.C/W, you can obtain the result to be expected.

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