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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Are there any reasons why junction-to-case (or channel-to-case) thermal resistance is not specified for small-package devices?

Neither junction-to-case thermal resistance, Rth(j-c), nor channel-to-case thermal resistance, Rth(ch-c), is specified because small-package devices do not dissipate much heat and because temperatures on the surface of small packages cannot be measured accurately. For thermal design, use either junction-to-ambient thermal resistance, Rth(j-a), or channel-to-ambient thermal resistance, Rth(ch-a), instead.