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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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5 Layout considerations for TVS diodes (ESD protection diodes)

Note that the placement of ESD protection diodes affects their ESD protection performance.
1. Place ESD protection diodes close to the ESD entry point.
2. Minimize trace inductance in series with ESD protection diodes including GND after the board traces originating from the connector diverge into two paths leading to ESD protection diodes and the DUP.

When an ESD protection diode is placed near the DUP/When an ESD protection diode is placed near the connector
Figure 5.1 Difference in clamp voltage depending  on the placement of ESD protection diodes
Figure 5.1 Difference in clamp voltage depending on the placement of ESD protection diodes
Figure 5.2 Board traces for ESD protection diodes
Figure 5.2 Board traces for ESD protection diodes

3. Do not run any board trace in parallel with a signal trace to which an ESD pulse might be introduced. In particular, avoid running board traces leading to a device with low ESD immunity in parallel with a board trace that could be exposed to an ESD event.

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