Part Number Search

Cross Reference Search

About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

Keyword Search

Parametric Search

Stock Check & Purchase

Select Product Categories

MOSFET Performance Improvement: Decision Factors of RDS(ON)

(1) The MOSFET device structure is selected according to the required withstand voltage. The factors that determine the on-resistance RDS (ON) are as shown in Figure 3-7 and Equation 3- (1). Depending on the structure of the device, the ratio of factors determining on-resistance will change.
(2) For example, many middle- and high-voltage MOSFETs (250 V or higher) have planar MOS (π-MOS) structure, and products with less than 200 V have more trench MOS (U-MOS). Therefore, when the withstand voltage VDSS = 600 V, Rdrift becomes the dominant factor, and in the case of 30 V, the ratio of Rch is high.

ON resistance decision factors of D-MOS
Fig. 3-7(a) ON resistance decision factors of D-MOS

RDS(ON)= Rsub + Rdrift + RJ-FET + Rch + RN+

ON resistance decision factors of trench MOS
Fig. 3-7(b) ON resistance decision factors of trench MOS

RDS(ON)= Rsub + Rdrift + Rch + RN+  ・・・  Equation 3-(1)

In the case of VDSS=600 V, the order is Rdrift >> Rch > RJ-FET , RN+ , Rsub  and RDS(ON) depends on Rdrift
In the case of VDSS=30V, the order is Rch >> Rdrift > RN+ , Rsub.  Dependence of RDS(ON) on Rch can be minimized by fine patterning of trench MOS structure.

Chapter III : Transistors

Types of Transistors
Bipolar Transistors (BJTs)
Bias Resistor Built-in Transistors (BRTs)
Junction Field-Effect Transistors (JFETs)
Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)
Differences between BJT and MOSFET
Structure and Operation of MOSFET
MOSFET Performance Improvement: Approach to Low RDS(ON)
MOSFET Performance Improvement: Super-Junction MOSFETs (SJ-MOS)
Summary of MOSFET Features by Structure
Performance of MOSFETs: Drain Current and Power Dissipation
Performance of MOSFETs: Avalanche Capability
Performance of MOSFETs: Characteristic of Capacitance
Performance of MOSFETs: Safe Operating Area(or Area of Safe Operation)
Insulated-Gate Bipolar Transistors (IGBTs)
Operation of Insulated-Gate Bipolar Transistors (IGBTs)
Performance Improvement of IGBTs: Evolution of Vertical Design
What are RC-IGBTs and IEGTs?
Application of IGBTs
Comparison of Forward Characteristics of IGBTs and MOSFETs
Comparison of Transistors by Structure
Datasheets of MOSFET: Maximum Ratings
Datasheets of MOSFET: Electrical Characteristics
Datasheets of MOSFET: Capacitance and Switching Characteristics
Datasheets of MOSFET: Body Diode

Related information

A new window will open