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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Features of Quad Flat Non-Leaded Packages (QFN)

  • Features: Small form factor, low pin count, leadframe, excellent cost performance
  • Structure: The QFN has electrode pads at the bottom of the package instead of leads.
  • Applications: Small mobile devices, cell phones, etc.
  • Ball pitch: 0.40 / 0.50 / 0.65 mm
  • Body size 4 × 4 mm to 7 × 7 mm
  • Pin count: 16 to 48 pins
qfn1

QFN Lineup

Package Type Package Name Pins Body Size
(mm)
Pin Pitch
(mm)
Height(Max)
(mm)
QFN 28 6 x 6 0.65 1.8
48 7 x 7 0.5 0.9
VQFN 20 4 x 4 0.5 0.9
24 4 x 4 0.5 0.95
32 5 x 5 0.5 0.9
32 5 x 5 0.5 0.9
36 5 x 5 0.4 1
36 5 x 5 0.5 0.9
40 6 x 6 0.5 0.9
48 6 x 6 0.4 0.8
XQFN 16 3 x 3 0.5 0.45
20 4 x 4 0.5 0.5
WQFN 16 3 x 3 0.5 0.75
20 4 x 4 0.5 0.75
24 4 x 4 0.5 0.75
28 5 x 5 0.5 0.8
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