Part Number Search

Cross Reference Search

About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

Keyword Search

Parametric Search

Stock Check & Purchase

Select Product Categories

When multiple semiconductor devices are arranged on the same board, is it necessary to consider thermal interference?

In the case that multiple semiconductor devices are arranged as heating sources on the same board, mutual thermal interference occurs due to distance etc.
In particular, in the case of proximity arrangement of semiconductor devices that reach high temperature, the temperature becomes higher than when such devices are used alone, as a result of the synergistic effect.
In the case below, even though the power loss of each device is the same, the temperature of a device located at or near the center will be higher.

A new window will open