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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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New Products / News

Lineup Expansion of Power MOSFETs of SOP Advance(WF) Packages That Contribute to Lower Power Consumption for Automotive Equipment : XPH2R106NC, XPH3R206NC
Lineup Expansion of Power MOSFETs of SOP Advance(WF) Packages That Contribute to Lower Power Consumption for Automotive Equipment : XPH2R106NC, XPH3R206NC
New press pack IEGT that contributes to size reduction and higher efficiency of industrial equipment such as high voltage direct current transmission systems and inverters for industrial motor drives:ST2000GXH32
New press pack IEGT that contributes to size reduction and higher efficiency of industrial equipment such as high voltage direct current transmission systems and inverters for industrial motor drives: ST2000GXH32
Lineup expansion of small MOSFETs for automotive equipment that help reduce power consumption with low On-resistance:SSM6K818R
Lineup expansion of small MOSFETs for automotive equipment that help reduce power consumption with low On-resistance: SSM6K818R
Expansion of the lineup of automotive bipolar transistors helping downsizing equipment : TTC502
Expansion of the lineup of automotive bipolar transistors helping downsizing equipment : TTC502

Design & Development

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TC35667FTG-006

EOL announced

Bluetooth® IC

Description

Feature LE single / Scatternet support / Standalone mode support
Automotive Support N/A
Bluetooth Category Bluetooth® low energy
Bluetooth Core spec. 4.1
Embedded Profiles GATT / SMP
Interfacing I2C / SPI / UART / PWM / ADC
User RAM Size (KB) 32
User Flash Size (KB) N/A
Function ARM® ARM7TDMI-S™ / RF analog circuitry / DC-DC converter / low power mode(4 level)
Other Functions Scatternet
RoHS Compatible Product(s) (#) Available
Status Not recommended for new design

Package Information

Toshiba Package Name P-VQFN40-0606-0.50-001
Package Image P-VQFN40-0606-0.50-001
Package name QFN
Pins 40
Mounting Surface Mount
Package size 6.0 mm x 6.0 mm
Pin pitch 0.5 mm
Package Dimensions View
Land pattern dimensions View

 Please refer to the link destination to check the detailed size.

Electrical Characteristics

Characteristics Symbol Condition Value Unit
Operating Temperature (Max) Topr - 85 ℃
Operating Temperature (Min) Topr - -40 ℃
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 1.8 V
Current Consumption in RX Active mode (peak) IRX (3.0V) 6.3 mA
Current Consumption in TX Active mode (peak) ITX (3.0V, TX -4dBm) 6.3 mA
Current Consumption in Sleep mode ISleep - 10 μA
Current Consumption in Deep Sleep mode IDSleep - 0.05 μA
Transmit Power(Max) PTrans - 0 dBm
Receiver Sensitivity - - -92 dBm

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